參數(shù)資料
型號: MMDF2C02E
廠商: ON SEMICONDUCTOR
英文描述: Dual Power MOSFET 2.5 Amps, 25 Volts(2.5A,25V,雙功率MOS場效應(yīng)管(N溝道+P溝道))
中文描述: 雙功率MOSFET2.5安培,25伏(包2.5a,25V的,雙功率馬鞍山場效應(yīng)管(不適用溝道P溝道))
文件頁數(shù): 8/12頁
文件大小: 140K
代理商: MMDF2C02E
MMDF2C02E
http://onsemi.com
8
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curves define
the maximum simultaneous drain–to–source voltage and
drain current that a transistor can handle safely when it is
forward biased. Curves are based upon maximum peak
junction temperature and a case temperature (TC) of 25
°
C.
Peak repetitive pulsed power limits are determined by using
the thermal response data in conjunction with the procedures
discussed in AN569, “Transient Thermal Resistance –
General Data and Its Use.”
Switching between the off–state and the on–state may
traverse any load line provided neither rated peak current
(IDM) nor rated voltage (VDSS) is exceeded, and that the
transition time (tr, tf) does not exceed 10
μ
s. In addition the
total power averaged over a complete switching cycle must
not exceed (TJ(MAX) – TC)/(R
θ
JC).
A power MOSFET designated E–FET can be safely used
in switching circuits with unclamped inductive loads. For
reliable operation, the stored energy from circuit inductance
dissipated in the transistor while in avalanche must be less
than the rated limit and must be adjusted for operating
conditions differing from those specified. Although industry
practice is to rate in terms of energy, avalanche energy
capability is not a constant. The energy rating decreases
non–linearly with an increase of peak current in avalanche
and peak junction temperature.
Although many E–FETs can withstand the stress of
drain–to–source avalanche at currents up to rated pulsed
current (IDM), the energy rating is specified at rated
continuous current (ID), in accordance with industry
custom. The energy rating must be derated for temperature
as shown in the accompanying graph (Figure 9). Maximum
energy at currents below rated continuous ID can safely be
assumed to equal the values indicated.
TJ, STARTING JUNCTION TEMPERATURE (
°
C)
EA
A
025
50
75
100
125
120
I pk = 9 A
200
150
280
80
40
160
240
Figure 8. Maximum Rated Forward Biased
Safe Operating Area
Figure 9. Maximum Avalanche Energy versus
Starting Junction Temperature
Figure 8. Maximum Rated Forward Biased
Safe Operating Area
Figure 9. Maximum Avalanche Energy versus
Starting Junction Temperature
0.1
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
1
10
I
RDS(on) LIMIT
THERMAL LIMIT
PACKAGE LIMIT
0.01
VGS = 20 V
SINGLE PULSE
TC = 25
°
C
10
0.1
dc
10 ms
1
100
100
Mounted on 2
sq. FR4 board (1
sq. 2 oz. Cu 0.06
thick single sided) with one die operating, 10s max.
100
μ
s10
μ
s
0.1
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
1
10
I
RDS(on) LIMIT
THERMAL LIMIT
PACKAGE LIMIT
0.01
VGS = 20 V
SINGLE PULSE
TC = 25
°
C
10
0.1
dc
10 ms
1
100
100
Mounted on 2
sq. FR4 board (1
sq. 2 oz. Cu 0.06
thick single sided) with one die operating, 10s max.
100
μ
s
10
μ
s
TJ, STARTING JUNCTION TEMPERATURE (
°
C)
EA
A
025
50
75
100
125
120
I pk = 7 A
200
150
280
80
40
160
240
N–Channel
P–Channel
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