參數(shù)資料
型號: MDS212CG
廠商: ZARLINK SEMICONDUCTOR INC
元件分類: 網(wǎng)絡(luò)接口
英文描述: 12-Port 10/100Mbps Ethernet Switch
中文描述: DATACOM, LAN SWITCHING CIRCUIT, PBGA456
封裝: 35 X 35 MM, 2.33 MM HEIGHT, MS-034, HSBGA-456
文件頁數(shù): 101/111頁
文件大?。?/td> 1609K
代理商: MDS212CG
MDS212
Data Sheet
101
Zarlink Semiconductor Inc.
19.0 DC Electrical Characteristics
19.1 Absolute Maximum Ratings
Package: 456 HBGA (Heatslug BGA)
Storage Temperature: -65C to +150C
Operating Temperature: 0C to +70C
Maximum Junction Temperature: 125C
Supply Voltage VCC with Respect to VSS
+3.0 V to +3.6 V
Supply Voltage VDD with Respect to VSS
+2.38 V to +2.75 V
Voltage on 5V Tolerant Input Pins
-0.5 V to (VCC + 3.3 V)
Caution:
Stresses above those listed may cause permanent device failure. Functionality at or above these limits is
not implied. Exposure to the Absolute Maximum Ratings for extended periods may affect device reliability.
19.2 DC Electrical Characteristics
VCC = 3.0 V to 3.6 V (3.3v +/- 10%)
VDD = 2.5V +10% - 5%
T
AMBIENT
= 0 C to +70 C
Note 1:
When external heat sink is attached,
θ
JA
is reduced by about 8-12% in still air.
Recommended Operating Conditions
Symbol
Parameter Description
Min
Type
Max
Unit
f
osc
I
CC
I
DD
V
OH
V
OL
V
IH-TTL
V
IL-TTL
I
IL
Frequency of Operation
Supply Current – @ 100 MHz (VCC =3.3 V)
Supply Current – @ 100 MHz (VDD =2.5 V)
Output High Voltage (CMOS)
Output Low Voltage (CMOS)
Input High Voltage (TTL 5V tolerant)
Input Low Voltage (TTL 5V tolerant)
Input Leakage Current (all pins except those with
internal pull-up/pull-down resistors)
Output Leakage Current
Input Capacitance
Output Capacitance
I/O Capacitance
Thermal resistance with 0 air flow
Thermal resistance with 1 m/s air flow
Thermal resistance with 2 m/s air flow
Thermal resistance between junction and case
100
220
720
MHz
mA
286
936
2.4
V
V
V
V
μ
A
0.4
2.0
VCC + 2.0
0.8
10
I
OL
C
IN
C
OUT
C
I/O
θ
ja
θ
ja
θ
ja
θ
jc
10
5
5
7
12
1
11
9.6
3.3
μ
A
pF
pF
pF
C/W
C/W
C/W
C/W
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