參數(shù)資料
型號(hào): M12L2561616A
廠商: Elite Semiconductor Memory Technology Inc.
英文描述: 4M x 16 Bit x 4 Banks Synchronous DRAM
中文描述: 4米× 16位× 4個(gè)銀行同步DRAM
文件頁數(shù): 14/44頁
文件大小: 908K
代理商: M12L2561616A
ES MT
Write command
(CS ,CAS ,
WE
= Low, RAS = High)
If the mode register is in the burst write mode, this command sets the burst start
address given by the column address to begin the burst write operation. The first
write data in burst can be input with this command with subsequent data on following
clocks.
Read command
(CS ,CAS = Low, RAS ,
WE
= High)
Read data is available afterCAS latency requirements have been met.
This command sets the burst start address given by the column address.
CBR (auto) refresh command
(CS ,RAS ,CAS = Low,
WE
, CKE = High)
This command is a request to begin the CBR refresh operation. The refresh
address is generated internally.
Before executing CBR refresh, all banks must be precharged.
After this cycle, all banks will be in the idle (precharged) state and ready for a
row activate command.
During t
RC
period (from refresh command to refresh or activate command), the
M12L2561616A cannot accept any other command.
M12L2561616A
Elite Semiconductor Memory Technology Inc.
Revision
:
1.2
Publication Date
:
Aug. 2007
14/44
CLK
CLK
CKE
CKE
CS
CS
RAS
RAS
WE
WE
BA0,BA1
(Bank select)
BA0,BA1
(Bank select)
A10
A10
Add
Add
CAS
CAS
H
H
Col.
Fig. 4 Column address and
write command
Fig. 5 Column address and
read command
CLK
CKE
CS
RAS
WE
BA0,BA1
(Bank select)
A10
Add
CAS
H
Fig. 6 Auto refresh command
Col.
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