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| 型號(hào)： | ISP1161ABM |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 總線控制器 |
| 英文描述： | Full-speed Universal Serial Bus single-chip host and device controller |
| 中文描述： | UNIVERSAL SERIAL BUS CONTROLLER, PQFP64 |
| 封裝： | 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-414-1, LQFP-64 |
| 文件頁(yè)數(shù)： | 131/134頁(yè) |
| 文件大?。?/td> | 587K |
| 代理商： | ISP1161ABM |
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Philips Semiconductors
ISP1161A
Full-speed USB single-chip host and device controller
Product data
Rev. 03 — 23 December 2004
131 of 134
9397 750 13962
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
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相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISP1161 | Full-speed Universal Serial Bus single-chip host and device controller |
| ISP1161A1 | Universal Serial Bus single-chip host and device controller |
| ISP1161A1BD | Universal Serial Bus single-chip host and device controller |
| ISP1161A1BM | Universal Serial Bus single-chip host and device controller |
| ISP1161BD | Full-speed Universal Serial Bus single-chip host and device controller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1161ABM,518 | 功能描述:USB 接口集成電路 DO NOT USE ORDER ISP1161A1BM RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1161ABM,551 | 功能描述:USB 接口集成電路 DO NOT USE ORDER ISP1161A1BM RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1161ABM,557 | 功能描述:USB 接口集成電路 DO NOT USE ORDER ISP1161A1BM RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1161ABM-S | 功能描述:IC USB HOST CTRL FULL-SPD 64LQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A |
| ISP1161ABM-T | 功能描述:IC USB HOST CTRL FULL-SPD 64LQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A |
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