參數(shù)資料
型號(hào): IS42S16128-10T
廠商: INTEGRATED SILICON SOLUTION INC
元件分類: DRAM
英文描述: 128K Words x 16 Bits x 2 Banks (4-MBIT) SYNCHRONOUS DYNAMIC RAM
中文描述: 256K X 16 SYNCHRONOUS DRAM, 10 ns, PDSO50
封裝: 0.400 INCH, TSOP2-50
文件頁(yè)數(shù): 22/75頁(yè)
文件大小: 638K
代理商: IS42S16128-10T
22
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
IS42S16128
ISSI
Burst Read
The read cycle is started by executing the read command.
The address provided during read command execution is
used as the starting address. First, the data correspond-
ing to this address is output in synchronization with the
clock signal after the
CAS
latency period. Next, data
corresponding to an address generated automatically by
the device is output in synchronization with the clock
signal.
The output buffers go to the LOW impedance state
CAS
latency minus one cycle after the read command, and go
to the HIGH impedance state automatically after the last
data is output. However, the case where the burst length
is a full page is an exception. In this case the output
buffers must be set to the high impedance state by
executing a burst stop command.
Note that upper byte and lower byte output data can be
masked independently under control of the signals ap-
plied to the U/LDQM pins. The delay period (t
QMD
) is fixed
at two, regardless of the
CAS
latency setting, when this
function is used.
The selected bank must be set to the active state before
executing this command.
BURST LENGTH
CAS LATENCY
t
CAC
READ
COMMAND
I/O
CLK
D
OUT
0
D
OUT
1
D
OUT
2
D
OUT
3
CAS
latency = 3, burst length = 4
Burst Write
The write cycle is started by executing the command. The
address provided during write command execution is
used as the starting address, and at the same time, data
for this address is input in synchronization with the clock
signal.
Next, data is input in other in synchronization with the
clock signal. During this operation, data is written to
address generated automatically by the device. This
cycle terminates automatically after a number of clock
cycles determined by the stipulated burst length. How-
ever, the case where the burst length is a full page is an
exception. In this case the write cycle must be terminated
by executing a burst stop command.
The latency for I/O pin data input is zero, regardless of the
CAS
latency setting. However, a wait period (write recov-
ery: t
DPL
) after the last data input is required for the device
to complete the write operation.
Note that the upper byte and lower byte input data can be
masked independently under control of the signals ap-
plied to the U/LDQM pins. The delay period (t
DMD
) is fixed
at zero, regardless of the
CAS
latency setting, when this
function is used.
The selected bank must be set to the active state before
executing this command.
BURST LENGTH
WRITE
COMMAND
I/O
CLK
D
IN
0
D
IN
1
D
IN
2
D
IN
3
CAS
latency = 2,3, burst length = 4
相關(guān)PDF資料
PDF描述
IS42S16128-12T 128K Words x 16 Bits x 2 Banks (4-MBIT) SYNCHRONOUS DYNAMIC RAM
IS42S16128-8T Chassis Mount and Din Rail Filters RoHS Compliant: Yes
IS42S16160B-7TL 32Meg x 8, 16Meg x16 256-MBIT SYNCHRONOUS DRAM
IS42S16160B-7TLI 32Meg x 8, 16Meg x16 256-MBIT SYNCHRONOUS DRAM
IS42S83200B 32Meg x 8, 16Meg x16 256-MBIT SYNCHRONOUS DRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IS42S16128-12T 制造商:ISSI 制造商全稱:Integrated Silicon Solution, Inc 功能描述:128K Words x 16 Bits x 2 Banks (4-MBIT) SYNCHRONOUS DYNAMIC RAM
IS42S16128-8T 制造商:ISSI 制造商全稱:Integrated Silicon Solution, Inc 功能描述:128K Words x 16 Bits x 2 Banks (4-MBIT) SYNCHRONOUS DYNAMIC RAM
IS42S16160A-6T 制造商:ISSI 制造商全稱:Integrated Silicon Solution, Inc 功能描述:256 Mb Synchronous DRAM
IS42S16160A-6TL 制造商:ISSI 制造商全稱:Integrated Silicon Solution, Inc 功能描述:256 Mb Synchronous DRAM
IS42S16160A-7T 制造商:Integrated Silicon Solution Inc 功能描述: