參數(shù)資料
型號: INTELDX2
廠商: Intel Corp.
英文描述: High-Performance 32-Bit Embedded Processor(高性能32位嵌入式處理器)
中文描述: 高性能32位嵌入式處理器(高性能32位嵌入式處理器)
文件頁數(shù): 48/48頁
文件大?。?/td> 486K
代理商: INTELDX2
44
Embedded IntelDX2 Processor
6.2
Package Thermal Specifications
The embedded IntelDX2 processor is specified for
operation when the case temperature (T
) is within
the range of 0°C to 85°C. T
may be measured in
any environment to determine whether the processor
is within the specified operating range.
The ambient temperature (T
) can be calculated
from
θ
JC
and
θ
JA
from the following equations:
T
J
= T
C
+ P *
θ
JC
T
A
= T
J
- P *
θ
JA
T
C
= T
A
+ P * [
θ
JA
-
θ
JC
]
T
A
= T
C
- P * [
θ
JA
-
θ
JC
]
Where T
, T
, T
equals Junction, Ambient and
Case Temperature respectively.
θ
,
θ
equals
Junction-to-Case and Junction-to-Ambient thermal
Resistance, respectively. P is defined as Maximum
Power Consumption.
Values for
θ
and
θ
are given in the following
tables for each product at its maximum operating
frequencies. Maximum T
is shown for each product
operating at various processor frequencies (twice
the CLK frequencies).
Table 26. Thermal Resistance,
θ
JA
(
°
C/W)
θ
JA
vs. Airflow — ft/min. (m/sec)
200
(1.01)
(2.03)
17.0
15.0
14.5
12.5
8.0
6.0
0
(0)
24.0
17.0
13.0
400
600
(3.04)
13.0
11.0
5.0
800
(4.06)
10.0
4.5
1000
(5.07)
9.5
4.25
208-Lead SQFP (3.3V) - Without Heat Sink
168-Pin PGA (5V) - Without Heat Sink
168-Pin PGA (5V) - With Heat Sink*
*0.350" high omnidirectional heat sink.
Table 27. Thermal Resistance,
θ
JC
(
°
C/W)
θ
JC
vs. Airflow — ft/min. (m/sec)
200
(1.01)
200
6.0
0
(0)
0
3.5
1.5
400
(2.03)
400
6.0
600
(3.04)
600
6.0
208-Lead SQFP (3.3V)
168-Pin PGA (5V)
Table 28. Maximum T
ambient,
T
A
max (
°
C)
Airflow — ft/min. (m/sec)
200
(1.01)
Freq.
(MHz)
0
(0)
400
(2.03)
600
(3.04)
IntelDX2 Processor
208-Lead SQFP (3.3V)
Without Heat Sink
168-Pin PGA (5V)
Without Heat Sink
168-Pin PGA (5V)
With Heat Sink
40
50
50
66
50
66
57
51
15
-4
33
19
70
67
26
11
56
48
73
70
35
22
65
59
75
73
46
36
69
65
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