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參數(shù)資料
| 型號： | INTELDX2 |
| 廠商： | Intel Corp. |
| 英文描述： | High-Performance 32-Bit Embedded Processor(高性能32位嵌入式處理器) |
| 中文描述： | 高性能32位嵌入式處理器（高性能32位嵌入式處理器） |
| 文件頁數(shù)： | 47/48頁 |
| 文件大?。?/td> | 486K |
| 代理商： | INTELDX2 |
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Embedded IntelDX2 Processor
43
Table 25. Ceramic PGA Package Dimension Symbols
Letter or Symbol
A
A
1
A
2
A
3
B
D
D
1
e
1
L
S
1
Description of Dimensions
Distance from seating plane to highest point of body
Distance between seating plane and base plane (lid)
Distance from base plane to highest point of body
Distance from seating plane to bottom of body
Diameter of terminal lead pin
Largest overall package dimension of length
A body length dimension, outer lead center to outer lead center
Linear spacing between true lead position centerlines
Distance from seating plane to end of lead
Other body dimension, outer lead center to edge of body
NOTES:
1. Controlling dimension: millimeter.
2.
Dimension “e
1
” (“e”) is non-cumulative.
3. Seating plane (standoff) is defined by P.C. board hole size: 0.0415–0.0430 inch.
4. Dimensions “B”, “B
1
” and “C” are nominal.
5. Details of Pin 1 identifier are optional.
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