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參數資料
| 型號： | IDT82V3202NLG |
| 廠商： | IDT, Integrated Device Technology Inc |
| 文件頁數： | 113/117頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC PLL WAN EBU SGL 68-VFQFPN |
| 標準包裝： | 21 |
| 類型： | 時鐘/頻率發(fā)生器，多路復用器 |
| PLL： | 是 |
| 主要目的： | 以太網，SONET/SDH，Stratum |
| 輸入： | CMOS |
| 輸出： | CMOS，LVDS，PECL |
| 電路數： | 1 |
| 比率 - 輸入:輸出： | 2:2 |
| 差分 - 輸入:輸出： | 無/是 |
| 頻率 - 最大： | 622.08MHz |
| 電源電壓： | 3 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 68-VFQFN 裸露焊盤 |
| 供應商設備封裝： | 68-VFQFPN（10x10） |
| 包裝： | 托盤 |
| 其它名稱： | 82V3202NLG |
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IDT82V3202
EBU WAN PLL
Programming Information
95
September 11, 2009
7
THERMAL MANAGEMENT
The device operates over the industry temperature range -40°C ~
+85°C. To ensure the functionality and reliability of the device, the maxi-
mum junction temperature Tjmax should not exceed 125°C. In some
applications, the device will consume more power and a thermal solution
should be provided to ensure the junction temperature Tj does not
exceed the Tjmax.
7.1
JUNCTION TEMPERATURE
Junction temperature Tj is the temperature of package typically at the
geographical center of the chip where the device's electrical circuits are.
It can be calculated as follows:
Equation 1: Tj = TA + P X θJA
Where:
θJA = Junction-to-Ambient Thermal Resistance of the Package
Tj = Junction Temperature
TA = Ambient Temperature
P = Device Power Consumption
In order to calculate junction temperature, an appropriate
θJA must
be used. The
Power consumption is the core power excluding the power dissipated
in the loads. Table 33 provides power consumption in special environ-
ments.
7.2
EXAMPLE OF JUNCTION TEMPERATURE
CALCULATION
Assume:
TA = 85°C
θJA = 21.7°C/W (TQFP/EDG64 Soldered & when airfow rate is 0 m/s)
P = 1.57W
The junction temperature Tj can be calculated as follows:
Tj = TA + P X θJA = 85°C + 1.57W X 21.7°C/W = 119.1°C
The junction temperature of 119.1°C is below the maximum junction
temperature of 125°C so no extra heat enhancement is required.
In some operation environments, the calculated junction temperature
might exceed the maximum junction temperature of 125°C and an exter-
nal thermal solution such as a heatsink is required.
7.3
HEATSINK EVALUATION
A heatsink is expanding the surface area of the device to which it is
attached.
θJA is now a combination of device case and heat-sink thermal
resistance, as the heat flowing from the die junction to ambient goes
through the package and the heatsink.
θJA can be calculated as follows:
Equation 2:
θJA = θJC + θCH+ θHA
Where:
θJC = Junction-to-Case Thermal Resistance
θCH = Case-to-Heatsink Thermal Resistance
θHA = Heatsink-to-Ambient Thermal Resistance
θCH+ θHA determines which heatsink and heatsink attachment can
be selected to ensure the junction temperature does not exceed the
maximum junction temperature. According to Equation 1 and 2,
θCH+ θHA can be calculated as follows:
Equation 3:
θCH+ θHA = (Tj - TA) / P - θJC
Assume:
Tj = 125°C (Tjmax)
TA = 85°C
P = 1.57W
θJC = 12.6°C/W (TQFP/EDG64)
θCH+ θHA can be calculated as follows:
θCH+ θHA = (125°C - 85°C ) / 1.57W - 12.6°C/W = 12.9°C/W
That is, if a heatsink and heatsink attachment whose θCH+ θHA is
below or equal to 12.9°C/W is used in such operation environment, the
junction temperature will not exceed the maximum junction temperature.
Table 32: Power Consumption and Maximum Junction Temperature
Package
Power
Consumption (W)
Operating
Voltage
(V)
TA (°C)
Maximum
Junction
Temperature (°C)
VFQFPN/NL68
1.57
3.6
85
125
TQFP/EDG64
1.57
3.6
85
125
Table 33: Thermal Data
Package
Pin Count Thermal Pad
θJC (°C/W)
θJB (°C/W)
θJA (°C/W) Air Flow in m/s
012345
VFQFPN/NL68
68
Yes/Exposed
9.1
8.3
39.4
34.1
31.7
30.2
29.1
28.2
VFQFPN/NL68
68
Yes/Soldered*
9.1
1.2
20.9
16.2
15.2
14.6
14.1
13.8
TQFP/EDG64
64
Yes/Exposed
12.6
35.3
37.0
32.1
30.4
29.4
28.7
28.1
TQFP/EDG64
64
Yes/Soldered
12.6
1.3
21.7
17.3
16.2
15.6
15.2
14.9
*note: Simulated with 3 x 3 array of thermal vias.
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| IDT82V3202NLG8 | 功能描述:IC PLL WAN EBU SGL 68-VFQFPN RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 專用 系列:- 標準包裝:1,500 系列:- 類型:時鐘緩沖器/驅動器 PLL:是 主要目的:- 輸入:- 輸出:- 電路數:- 比率 - 輸入:輸出:- 差分 - 輸入:輸出:- 頻率 - 最大:- 電源電壓:3.3V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:28-SSOP（0.209"，5.30mm 寬） 供應商設備封裝:28-SSOP 包裝:帶卷 (TR) 其它名稱:93786AFT |
| IDT82V3202NLGBLANK | 制造商:IDT 制造商全稱:Integrated Device Technology 功能描述:EBU WAN PLL |
| IDT82V3255 | 制造商:IDT 制造商全稱:Integrated Device Technology 功能描述:WAN PLL |
| IDT82V3255_08 | 制造商:IDT 制造商全稱:Integrated Device Technology 功能描述:WAN PLL |
| IDT82V3255DK | 制造商:IDT 制造商全稱:Integrated Device Technology 功能描述:WAN PLL |
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