- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄67681 > IBM25EMPPC603EBG-100 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255 PDF資料下載
參數(shù)資料
| 型號： | IBM25EMPPC603EBG-100 |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 1.27 MM PITCH, 3 MM HEIGHT, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 31/42頁 |
| 文件大?。?/td> | 509K |
| 代理商： | IBM25EMPPC603EBG-100 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁當前第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁
603e and EM603e Hardware Specification
37
For a power dissipation of 2.5 Watts in an ambient temperature of 40
°C at 1 m/sec with the pinn heatsink
measured above, the junction temperature of the device is well within the reliability limits as follows:
Tj = Ta + Rθja * P
Tj = 40°C + (9.1°C/Watt * 2.5 Watts) = 63°C
Notes:
1. Junction-to-ambient thermal resistance is based on modeling.
2. Junction-to-heatsink thermal resistance is based on measurements and model using thermal test
chip and thermal couple which is placed on the base of the heatsink.
3.
θ
ja is not measured for 0.25 m/sec convection for the pinn.
The vendors who supply heatsinks are Aavid Engineering, Thermalloy, and Wakeeld Engineering. Any of
these vendors can supply heatsinks with sufcient thermal performance. The following list contains contact
information.
The vendors who supply heatsinks are Aavid Engineering, IERC, Thermalloy, and Wakeeld Engineering.
Contact information for these vendors follows:
Thermalloy
972-243-4321
2021 W. Valley View Lane
http://www.thermalloy.com
P.O. Box 810839
Dallas, TX 75731
International Electronic Research Corporation (IERC)
818-842-7277
135 W. Magnolia Blvd.
Burbank, CA 91502
Aavid Engineering
603-528-3400
One Kool Path
http://www.aavid.com
Laconic, NH 03247-0440
Wakeeld Engineering
781-406-3000
60 Audubon Rd.
www.wakeeld.com
Wakeeld, MA 01880
Any of these vendors can supply heatsinks with sufcient thermal performance.
1.8.6.2 CBGA Package
The data found in this section concerns 603e’s and EM603e’s packaged in the 255-lead 21 mm multi-layer
ceramic (MLC), CBGA package. Data is shown for two cases, the exposed-die case (no heatsink) and using
the Thermalloy 2338-pin n heatsink.
1.8.6.2.1 Thermal Characteristics
The internal thermal resistance for this package is negligible due to the exposed die design. A heatsink is
attached directly to the silicon die surface only when external thermal enhancement is necessary.
Additionally, the CBGA package offers an exceptional thermal connection to the card and power planes.
Heat generated at the chip is dissipated through the package, the heatsink (when used) and the card. The
parallel heat ow paths result in the lowest overall thermal resistance as well as offer signicantly better
power dissipation capability when a heatsink is not used.
相關PDF資料 |
PDF描述 |
|---|---|
| IBM25EMPPC740LDBC4000 | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA255 |
| IBM25EMPPC750LCBF3330 | 32-BIT, 333 MHz, RISC PROCESSOR, CBGA360 |
| IBM25EMPPC740LFBF4000 | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA255 |
| IBM25EMPPC750LDBC4000 | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 |
| IBM25EMPPC750LDBE3000 | 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| IBM25EMPPC740DBUB2330 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC |
| IBM25EMPPC740DBUB2660 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC |
| IBM25EMPPC740LEBA300 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
| IBM25EMPPC740LEBA333 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
| IBM25EMPPC740LEBA366 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
發(fā)布緊急采購，3分鐘左右您將得到回復。