參數(shù)資料
型號(hào)： IBM25EMPPC603EBG-100
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255
封裝： 21 X 21 MM, 1.27 MM PITCH, 3 MM HEIGHT, CERAMIC, BGA-255
文件頁(yè)數(shù)： 29/42頁(yè)
文件大小： 509K
代理商： IBM25EMPPC603EBG-100
603e and EM603e Hardware Specification
35
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the Vdd and OVdd planes, to enable quick recharging of the smaller chip capacitors. These bulk
capacitors should also have a low ESR (equivalent series resistance) rating to ensure the quick response time
necessary. They must also be connected to the power and ground planes through two vias to minimize
inductance. Suggested bulk capacitors—100
F (AVX TPS tantalum) or 330 F (AVX TPS tantalum).
1.8.4 Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unused active low inputs should be tied to Vdd. Unused active high inputs should be connected to
GND. All NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external Vdd, OVdd, and GND pins of the 603e and
EM603e.
1.8.5 Pull-up Resistor Requirements
The 603e and EM603e requires high-resistive (weak: 10 K
) pull-up resistors on several control signals of
the bus interface to maintain the control signals in the negated state after they have been actively negated
and released by the 603e and EM603e or other bus master. These signals are—TS, ABB, DBB, and ARTRY.
In addition, the 603e and EM603e have three open-drain style outputs that require pull-up resistors (weak
or stronger: 4.7 K
–10K) if they are used by the system. These signals are—APE, DPE, and
CKSTP_OUT.
During inactive periods on the bus, the address and transfer attributes on the bus are not driven by any master
and may oat in the high-impedance state for relatively long periods of time. Since the 603e and EM603e
must continually monitor these signals for snooping, this oat condition may cause excessive power draw
by the input receivers on the 603e and EM603e. It is recommended that these signals be pulled up through
weak (10 K
) pull-up resistors or restored in some manner by the system. The snooped address and transfer
attribute inputs are—A[0–31], AP[0–3], TT[0–4], TBST, and GBL.
The data bus input receivers are normally turned off when no read operation is in progress and do not require
pull-up resistors on the data bus.
1.8.6 Thermal Management Information
This section provides thermal management data for the 603e and EM603e; the information found in the rst
sub-sections
through
Management Example”) is based on a typical embedded conguration using a C4FP package. The heatsink
used for this data is a pinn conguration from Thermalloy, part number 2338. The C4FP also uses a at
aluminum plate with dimensions of 24 x 24 mm and 1.5 mm thickness. The data found in the subsequent
sub-sections concerns 603e’s and EM603e’s packaged in the 255-lead 21 mm multi-layer ceramic (MLC),
CBGA package. Data is shown for two cases, the exposed-die case (no heatsink) and using the Thermalloy
2338-pin n heatsink.
1.8.6.1 C4FP Package
This section provides thermal management data for the 603e and EM603e; this information is based on a
typical embedded conguration using a 240 lead, 32 mm x 32 mm, C4FP package. The heatsink used for
this data is a pinn conguration from Thermalloy, part number 2338 and a at aluminum plate with
dimensions of 24 x 24 mm and 1.5 mm thickness.
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