參數(shù)資料
型號: IBM25EMPPC603EBG-100
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255
封裝: 21 X 21 MM, 1.27 MM PITCH, 3 MM HEIGHT, CERAMIC, BGA-255
文件頁數(shù): 18/42頁
文件大小: 509K
代理商: IBM25EMPPC603EBG-100
603e and EM603e Hardware Specification
25
1.7 PowerPC 603e and EM603e Processor Package
Descriptions
The following sections provide the package parameters and the mechanical dimensions for the 603e and
EM603e. Note that the 603e and EM603e are currently offered in the C4FP (and PFP for EM603e only), as
well as in a common ceramic ball grid array (CBGA) package.
1.7.1 C4FP Package Description
The following sections provide the package parameters and mechanical dimensions for the C4FP package.
1.7.1.1 Package Parameters
The package parameters are as provided in the following list. The package type is 32 mm x 32 mm, 240-pin
C4 at pack.
Package outline
32 mm x 32 mm
Interconnects
240
Pitch
0.5 mm
Lead plating material
Ni Au
Lead plating thickness
Ni = 50
± 25 -inch
Au = 13
± 5 -inch
Solder joint
Sn/Pb (10/90)
Lead encapsulation
Epoxy
Solder-bump encapsulation
Epoxy
Maximum module height
4.1 mm
Co-planarity specication
0.08 mm
Note: No solvent can be used with the C4FP package. See Appendix A, “.General Handling
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