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參數(shù)資料
| 型號： | BGB110 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | Bluetooth radio module |
| 中文描述： | SPECIALTY TELECOM CIRCUIT, XMA34 |
| 封裝： | 13.75 X 10.20 X 1.90 MM, LEADLESS, METAL CAP, SOT, MODULE-34 |
| 文件頁數(shù)： | 16/17頁 |
| 文件大?。?/td> | 141K |
| 代理商： | BGB110 |
2000 Oct 03
16
Philips Semiconductors
Objective specification
Bluetooth radio module
BGB110
DATA SHEET STATUS
Note
1.
Please consult the most recently issued data sheet before initiating or completing a design.
DATA SHEET STATUS
PRODUCT
STATUS
DEFINITIONS
(1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
DEFINITIONS
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BGB201 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Bluetooth System-in-a-Package radio with baseband controller |
| BGB203 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Bluetooth System-in-a-Package radio with baseband controller |
| BGB203/H1/S06,518 | 功能描述:RF片上系統(tǒng) - SoC BLUETOOTH 1.2 SIP RoHS:否 制造商:Texas Instruments 類型:Zigbee 處理器系列:CC253 核心:8051 最大數(shù)據(jù)速率:250 Kbps 輸出功率:4.5 dBm 靈敏度:- 97 dBm 工作電源電壓:2 V to 3.6 V 接收供電電流:24.3 mA 傳輸供電電流:33.5 mA 程序存儲器大小:256 KB 工作溫度范圍:- 40 C to + 125 C 封裝 / 箱體:QFN-40 |
| BGB203/H1/S06-T | 功能描述:RF片上系統(tǒng) - SoC BLUETOOTH 1.2 SIP RoHS:否 制造商:Texas Instruments 類型:Zigbee 處理器系列:CC253 核心:8051 最大數(shù)據(jù)速率:250 Kbps 輸出功率:4.5 dBm 靈敏度:- 97 dBm 工作電源電壓:2 V to 3.6 V 接收供電電流:24.3 mA 傳輸供電電流:33.5 mA 程序存儲器大小:256 KB 工作溫度范圍:- 40 C to + 125 C 封裝 / 箱體:QFN-40 |
| BGB203H1S06UM | 制造商:NXP Semiconductors 功能描述:IC BLUETOOTH SIP 48HVQFN |
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