參數(shù)資料
型號(hào): BGB110
廠商: NXP SEMICONDUCTORS
元件分類: 通信及網(wǎng)絡(luò)
英文描述: Bluetooth radio module
中文描述: SPECIALTY TELECOM CIRCUIT, XMA34
封裝: 13.75 X 10.20 X 1.90 MM, LEADLESS, METAL CAP, SOT, MODULE-34
文件頁(yè)數(shù): 11/17頁(yè)
文件大?。?/td> 141K
代理商: BGB110
2000 Oct 03
11
Philips Semiconductors
Objective specification
Bluetooth radio module
BGB110
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Notes
1.
Pins short-circuited internally must be short-circuited externally.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
S
V
ctrl
GND
supply voltage
control pin voltage
difference in ground supply
voltage between ground pins
total power dissipation
drive power at receiver input
storage temperature
ambient temperature
junction temperature
0.3
0.3
3.6
V
S
0.01
V
V
V
note 1
P
tot
P
D
T
stg
T
amb
T
j
55
10
tbd
0
+125
+50
150
W
dBm
°
C
°
C
°
C
SYMBOL
PARAMETER
VALUE
UNIT
R
th j-a
thermal resistance from junction to ambient
tbd
K/W
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