- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄369464 > BGB110 (NXP SEMICONDUCTORS) Bluetooth radio module PDF資料下載
參數(shù)資料
| 型號： | BGB110 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | Bluetooth radio module |
| 中文描述： | SPECIALTY TELECOM CIRCUIT, XMA34 |
| 封裝： | 13.75 X 10.20 X 1.90 MM, LEADLESS, METAL CAP, SOT, MODULE-34 |
| 文件頁數(shù)： | 15/17頁 |
| 文件大?。?/td> | 141K |
| 代理商： | BGB110 |
2000 Oct 03
15
Philips Semiconductors
Objective specification
Bluetooth radio module
BGB110
SOLDERING
The indicated temperatures are those at the solder
interfaces.
Advised solder types are types with a liquidus less than or
equal to 210
°
C.
Solder dots or solder prints must be large enough to wet
the contact areas.
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
A double reflow process is permitted.
Hand soldering is not recommended because the
soldering iron tip can exceed the maximum permitted
temperature of 250
°
C and damage the module.
In case handsoldering is needed, recommendations can
be found in RNR-45-98-A-0485.
The maximum allowed temperature is 250
°
C for a
maximum of 5 seconds.
The maximum ramp-up is 10
°
C per second.
The maximum cool-down is 5
°
C per second.
Cleaning
The following fluids may be used for cleaning:
Alcohol
Bio-Act (Terpene Hydrocarbon)
Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
Packing
An extended packing / SMD specification can be found in
document RNR-T49D-2183.
Fig.7 Recommended reflow temperature profile.
handbook, halfpage
0
200
100
0
1
5
2
3
4
MGM159
t (min)
T
(
°
C)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BGB550 | ?Biased RF-Trans. in SIEGET45 Technology Icmax = 300mA. SCT595 ? |
| BGD102 | CATV Wideband Amplier |
| BGD104 | PV SERIES |
| BGD108 | PV SERIES |
| BGD501 | |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BGB201 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Bluetooth System-in-a-Package radio with baseband controller |
| BGB203 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Bluetooth System-in-a-Package radio with baseband controller |
| BGB203/H1/S06,518 | 功能描述:RF片上系統(tǒng) - SoC BLUETOOTH 1.2 SIP RoHS:否 制造商:Texas Instruments 類型:Zigbee 處理器系列:CC253 核心:8051 最大數(shù)據(jù)速率:250 Kbps 輸出功率:4.5 dBm 靈敏度:- 97 dBm 工作電源電壓:2 V to 3.6 V 接收供電電流:24.3 mA 傳輸供電電流:33.5 mA 程序存儲器大小:256 KB 工作溫度范圍:- 40 C to + 125 C 封裝 / 箱體:QFN-40 |
| BGB203/H1/S06-T | 功能描述:RF片上系統(tǒng) - SoC BLUETOOTH 1.2 SIP RoHS:否 制造商:Texas Instruments 類型:Zigbee 處理器系列:CC253 核心:8051 最大數(shù)據(jù)速率:250 Kbps 輸出功率:4.5 dBm 靈敏度:- 97 dBm 工作電源電壓:2 V to 3.6 V 接收供電電流:24.3 mA 傳輸供電電流:33.5 mA 程序存儲器大小:256 KB 工作溫度范圍:- 40 C to + 125 C 封裝 / 箱體:QFN-40 |
| BGB203H1S06UM | 制造商:NXP Semiconductors 功能描述:IC BLUETOOTH SIP 48HVQFN |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。