參數(shù)資料
型號(hào): AM45DL32X8G
英文描述: 200NS, FLATPACK, 883C; LEV B COMPLIANT(EEPROM)
中文描述: Am45DL32x8G -堆疊式多芯片封裝(MCP)閃存和SRAM
文件頁(yè)數(shù): 1/64頁(yè)
文件大?。?/td> 1191K
代理商: AM45DL32X8G
July 2003
The following document specifies Spansion memory products that are now offered by both Advanced
Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-
inally developed the specification, these products will be offered to customers of both AMD and
Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a Spansion product. Any
changes that have been made are the result of normal datasheet improvement and are noted in the
document revision summary, where supported. Future routine revisions will occur when appropriate,
and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order
these products, please use only the Ordering Part Numbers listed in this document.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about Spansion
memory solutions.
Am45DL32x8G
Data Sheet
Publication Number
26502
Revision
A
Amendment
+3
Issue Date
August 28, 2002
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