參數(shù)資料
型號: ADSP-21060LC
廠商: Analog Devices, Inc.
英文描述: DSP Microcomputer(DSP 微計算機)
中文描述: 微機的DSP(數(shù)字信號處理器微計算機)
文件頁數(shù): 42/48頁
文件大小: 515K
代理商: ADSP-21060LC
–42–
ADSP-21060C/ADSP-21060LC
REV. PrA
PRELIMINARY
DATA
TECHNICAL
Value from the following table.
LOAD CAPACITANCE – pF
0
0
20
40
60
80
100
120
Y = 0.0391X + 0.36
Y = 0.0305X + 0.24
RISE TIME
FALL TIME
140
160
180
200
R
1
2
3
4
5
6
7
8
9
Figure 34. Typical Output Rise Time (0.8 V–2.0 V) vs.
Load Capacitance (V
DD
= 3.3 V)
E NVIRONME NT AL CONDIT IONS
T hermal Characteristics
T he ADSP-2106x is packaged in a 240-lead thermally enhanced
ceramic QFP (CQFP). T here are two package versions, one
with a copper/tungsten heat slug on top of the package (CZ) for
air cooling, and one with the heat slug on the bottom (CW) for
cooling through the board. T he ADSP-2106x is specified for a
case temperature (T
CASE
). T o ensure that the T
CASE
data sheet
specification is not exceeded, a heatsink and/or an air flow
source may be used. A heatsink should be attached with a ther-
mal adhesive.
T
CASE
=
T
AMB
+
(
PD
× θ
CA
)
T
CASE
= Case temperature (measured on the heat slug surface)
PD
=
Power dissipation in W (this value depends upon the
specific application; a method for calculating
PD
is
shown under Power Dissipation).
θ
CA
=
Airflow
(Linear Ft./Min.)
0
200
400
θ
CA
(
°
C /W)
18
13
11
T his represents thermal resistance at total power of 5 W.
With air flow, no variance is seen in
θ
CA
with power.
θ
JC
= 0.2
°
C /W.
LOAD CAPACITANCE – pF
O
5
–1
25
200
50
75
100
125
150
175
4
3
2
1
NOMINAL
Y = 0.0329X –1.65
Figure 35. Typical Output Delay or Hold vs. Load Capaci-
tance (at Maximum Case Temperature) (V
DD
= 3.3 V)
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