AD5590
Rev. A | Page 11 of 44
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted. VDD refers to DACVDD or
ADCVDD. GND refers to DACGND or ADCGND.
Table 7.
Parameter
Rating
VDD to GND
0.3 V to +7 V
VDRIVE to GND
0.3 V to VDD + 0.3 V
Op Amp Supply Voltage
6 V
Op Amp Input Voltage
(V1 or V2) 0.3 V to
(V1+ or V2+) + 0.3 V
Op Amp Differential Input Voltage
±6 V
Op Amp Output Short-Circuit
Duration to GND
Indefinite
Analog Input Voltage to GND
0.3 V to VDD + 0.3 V
Digital Input Voltage to GND
0.3 V to +7 V
Digital Output Voltage to GND
0.3 V to VDD +0.3 V
VREFA to GND
0.3 V to VDD +0.3 V
VREFIN/VREFOUT to GND
0.3 V to VDD +0.3 V
Input Current to Any ADC Pin
Except Supplies
±10 mA
Operating Temperature Range
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature (TJ max)
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a 4-layer JEDEC thermal test board for surface-
mount packages.
Table 8. Thermal Resistance
Package Type
θJA
Unit
80-Ball CSP_BGA
40
°C/W
Table 9. Junction Temperature
Parameter
Max
Unit
Comments
130
°C
TJ = TA + PTOTAL × θJA
1
PTOTAL is the sum of ADC, DAC, and operational amplifier supply currents.
2
θJA is the package thermal resistance.
ESD CAUTION