參數(shù)資料
型號(hào)： AD14160LKB-4
廠商： ANALOG DEVICES INC
元件分類： 數(shù)字信號(hào)處理
英文描述： Quad-SHARC DSP Multiprocessor Family
中文描述： 48-BIT, 40 MHz, OTHER DSP, CBGA452
封裝： CERAMIC, BGA-452
文件頁(yè)數(shù)： 42/52頁(yè)
文件大?。?/td> 1193K
代理商： AD14160LKB-4
AD14160/AD14160L
–42–
REV. A
Thermal Characteristics
The AD14160/AD14160L is packaged in a 452-lead ceramic
ball grid array (CBGA). The package is optimized for thermal
conduction through the core (base of the package) down to the
mounting surface. The AD14160/AD14160L is specified for a
case temperature (T
CASE
). Design of the mounting surface and
attachment material should be such that T
CASE
is not exceeded.
θ
JC
= 0.36
°
C/W
Thermal Cross-Section
The data below, together with the detailed mechanical drawings
at the end of the data sheet, allows for constructing simple ther-
mal models for further analysis within targeted systems. The top
layer of the package, where the die are mounted, is a metal V
DD
layer. The approximate metal area coverage from the metal
planes and routing layers is estimated below.
Thermal Conductivity
Thermal Conductivity
W/cm
8
C
Material
Ceramic
Kovar
Tungsten
Thermoplastic
Silicon
0.18
0.14
1.78
0.03
1.45
CERAMIC LAYER 4 MILS
CERAMIC LAYER 28 MILS
(2 LAYERS 14 MILS EACH)
CERAMIC LAYER 6 MILS
CERAMIC LAYER 6 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 4 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 4 MILS
SEAL RING METALIZATION
SILICON DIE
19 MILS
THERMOPLASTIC
THICKNESS 5 MILS
V
DD
SIG2
SIG3
GND
SIG4
SIG5
BASE
KOVAR SEAL RING
HEIGHT = 50 MILS
KOVAR LID
0.015 IN
SUB-PAD
SIGI
DBGA PADS
Figure 41.
Metal Coverage Per Layer
Percent Metal
(1 Mil Thick)
Layer
V
DD
SIG2
SIG3
GND
SIG4
SIG5
BASE
87
12
12
89
14
13
91
(Assume Uniformly Distributed)
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