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參數(shù)資料
| 型號： | 5962-0924001VXC |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | ADC |
| 英文描述： | 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP100 |
| 封裝： | HERMETIC SEALED, CERAMIC, QFP-100 |
| 文件頁數(shù)： | 23/46頁 |
| 文件大?。?/td> | 1109K |
| 代理商： | 5962-0924001VXC |
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SLAS669B
– SEPTEMBER 2010 – REVISED MAY 2011
THERMAL CHARACTERISTICS
(1)
PARAMETER
TEST CONDITIONS
TYP
UNIT
RθJA
JESD51-2 and JESD51-3 (2)
21.81
°C/W
RθJC
MIL-STD-883 Test Method 1012(3)
0.849
°C/W
(1)
This CQFP package has built-in vias that electrically and thermally connect the bottom of the die to a pad on the bottom of the package.
To efficiently remove heat and provide a low-impedance ground path, a thermal land is required on the surface of the PCB directly
underneath the body of the package. During normal surface mount flow solder operations, the heat pad on the underside of the package
is soldered to this thermal land creating an efficient thermal path. Normally, the PCB thermal land has a number of thermal vias within it
that provide a thermal path to internal copper areas (or to the opposite side of the PCB) that provide for more efficient heat removal. TI
typically recommends an 11,9 mm2 board-mount thermal pad. This allows maximum area for thermal dissipation, while keeping leads
away from the pad area to prevent solder bridging. A sufficient quantity of thermal/electrical vias must be included to keep the device
within recommended operating conditions. This pad must be electrically at ground potential.
(2)
RθJA is the thermal resistance from the junction to ambient.
(3)
RθJC is the thermal resistance from the junction to case.
RECOMMENDED OPERATING CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLIES
Analog supply voltage, AVDD5
4.75
5
5.25
V
Analog supply voltage, AVDD3
3.135
3.3
3.465
V
Digital supply voltage, DVDD3
3.135
3.3
3.465
V
ANALOG INPUT
Full-scale differential input range
1.52
2
Vpp
VCM
Input common mode
AVDD5/2
V
DIGITAL OUTPUT
Differential output load
5
pF
CLOCK INPUT
CLK input sample rate (sine wave)
100
1000
MSPS
Clock amplitude, differential
0.6
1.5
Vpp
Clock duty cycle
45%
50%
55%
TC
Operating case temperature
–55
125
°C
Copyright
2010–2011, Texas Instruments Incorporated
3
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