參數(shù)資料
型號: W3H64M72E-667SBCF
廠商: WHITE ELECTRONIC DESIGNS CORP
元件分類: DRAM
英文描述: 64M X 72 DDR DRAM, PBGA208
封裝: 16 X 22 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208
文件頁數(shù): 14/32頁
文件大?。?/td> 944K
代理商: W3H64M72E-667SBCF
W3H64M72E-XSBX
W3H64M72E-XSBXF
21
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
December 2009
2010 White Electronic Designs Corp. All rights reserved
Rev. 9
White Electronic Designs Corp. reserves the right to change products or specications without notice.
PRECHARGE COMMAND
The PRECHARGE command, illustrated in Figure 13, is
used to deactivate the open row in a particular bank or
the open row in all banks. The bank(s) will be available
for a subsequent row activation a specied time (tRP)
after the PRECHARGE command is issued, except in
the case of concurrent auto precharge, where a READ or
WRITE command to a different bank is allowed as long
as it does not interrupt the data transfer in the current
bank and does not violate any other timing parameters.
Once a bank has been precharged, it is in the idle state
and must be activated prior to any READ or WRITE
commands being issued to that bank. A PRECHARGE
command is allowed if there is no open row in that bank
(idle state) or if the previously open row is already in the
process of precharging. However, the precharge period
will be determined by the last PRECHARGE command
issued to the bank.
PRECHARGE OPERATION
Input A10 determines whether one or all banks are to be
precharged, and in the case where only one bank is to be
precharged, inputs BA2–BA0 select the bank. Otherwise
BA2–BA0 are treated as “Don’t Care.”
When all banks are to be precharged, inputs BA2–BA0
are treated as “Don’t Care.” Once a bank has been
precharged, it is in the idle state and must be activated prior
to any READ or WRITE commands being issued to that
bank. tRPA timing applies when the PRECHARGE (ALL)
command is issued, regardless of the number of banks
already open or closed. If a single-bank PRECHARGE
command is issued, tRP timing applies. tRPA (MIN) applies
to all 8-bank DDR2 devices.
SELF REFRESH COMMAND
The SELF REFRESH command can be used to retain
data in the DDR2 SDRAM, even if the rest of the system
is powered down. When in the self refresh mode, the
DDR2 SDRAM retains data without external clocking. All
power supply inputs (including VREF) must be maintained
at valid levels upon entry/exit and during SELF REFRESH
operation.
The SELF REFRESH command is initiated like a
REFRESH command except CKE is LOW. The DLL is
automatically disabled upon entering self refresh and is
automatically enabled upon exiting self refresh (200 clock
CS#
WE#
CAS#
RAS#
CKE
A10
BA0 - BA2
HIGH
ALL BANKS
ONE BANK
BA
ADDRESS
CK
CK#
DON’T CARE
FIGURE 13 – PRECHARGE COMMAND
Note: BA = bank address (if A10 is LOW; otherwise "Don't Care").
cycles must then occur before a READ command can be
issued). The differential clock should remain stable and
meet tCKE specications at least 1 x tCK after entering
self refresh mode. All command and address input signals
except CKE are “Don’t Care” during self refresh.
The procedure for exiting self refresh requires a sequence
of commands. First, the differential clock must be stable
and meet tCK specications at least 1 x tCK prior to CKE
going back HIGH. Once CKE is HIGH (tCLE(MIN) has
been satised with four clock registrations), the DDR2
SDRAM must have NOP or DESELECT commands issued
for tXSNR because time is required for the completion of
any internal refresh in progress. A simple algorithm for
meeting both refresh and DLL requirements is to apply
NOP or DESELECT commands for 200 clock cycles before
applying any other command.
Note: Self refresh not available at military temperature..
相關(guān)PDF資料
PDF描述
WS512K32-25G4C 2M X 8 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68
WS1M8V-17CM 1M X 8 STANDARD SRAM, 17 ns, CDIP32
WS1M8V-20CC 1M X 8 STANDARD SRAM, 20 ns, CDIP32
WS1M8V-35CC 1M X 8 STANDARD SRAM, 35 ns, CDIP32
WS256K8-25CQE 256K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CDMA32
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W3H64M72E-667SBI 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 667MHZ, 208PBGA INDUSTRIAL TEMP. - Bulk
W3H64M72E-667SBM 制造商:Microsemi Corporation 功能描述:64M X 72 DDR2, 1.8V, 667MHZ, 208PBGA MIL-TEMP. - Bulk 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY
W3H64M72EERXXXAD7MG 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512MB - 64Mx72 DDR2 SDRAM REGISTERED, w/PLL, VLP Mini-DIMM
W3H64M72EERXXXAD7SG 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512MB - 64Mx72 DDR2 SDRAM REGISTERED, w/PLL, VLP Mini-DIMM
W3H64M72E-ES 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package