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參數(shù)資料
| 型號： | W3H32M72E-400SB2M |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | DRAM |
| 英文描述： | 32M X 72 DDR DRAM, 0.6 ns, PBGA208 |
| 封裝： | 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 |
| 文件頁數(shù)： | 18/25頁 |
| 文件大?。?/td> | 1062K |
| 代理商： | W3H32M72E-400SB2M |
W3H32M72E-XSB2X
November 2010 2010 Microsemi Corporation. All rights reserved.
25
Microsemi Corporation (602) 437-1520 www.whiteedc.com
Rev. 3
www.microsemi.com
Microsemi Corporation reserves the right to change products or specications without notice.
Document Title
32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
Revision History
Rev #
History
Release Date
Status
Rev 0
Initial Release
November 2009
Preliminary
Rev 1
Change (Pg. 23)
1.1 Set BGA Thermal Resistance to TBD
November 2009
Preliminary
Rev 2
Change (Pg. 28)
2.1 Update MO drawing thickness to 3.08 (0.121) max, length to 20.10 (0.791)
max and width to 16.10 (0.634) max
2.2 Remove note from BGA thermal resistance
March 2010
Preliminary
Rev 3
Change (Pg. 17, 18)
3.1 Updated capacitance measurements in input/output capacitance table
3.2 Updated BGA thermal resistance table
November
Final
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W3H32M72E-400SBC | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 400MHZ, 208PBGA COMMERICAL TEMP. - Bulk |
| W3H32M72E-400SBI | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 400MHZ, 208PBGA INDUSTRIAL TEMP. - Bulk |
| W3H32M72E-400SBM | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 400MHZ, 208PBGA MIL-TEMP. - Bulk |
| W3H32M72E-533ES | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M72E-533ESC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
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