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參數(shù)資料
| 型號： | W3H32M72E-400SB2M |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | DRAM |
| 英文描述： | 32M X 72 DDR DRAM, 0.6 ns, PBGA208 |
| 封裝： | 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 |
| 文件頁數(shù)： | 15/25頁 |
| 文件大?。?/td> | 1062K |
| 代理商： | W3H32M72E-400SB2M |
W3H32M72E-XSB2X
November 2010 2010 Microsemi Corporation. All rights reserved.
22
Microsemi Corporation (602) 437-1520 www.whiteedc.com
Rev. 3
www.microsemi.com
Microsemi Corporation reserves the right to change products or specications without notice.
AC TIMING PARAMETERS
(continued)
-55°C ≤ TA ≤ +125°C; VCCQ = + 1.8V ± 0.1V, VCC = +1.8V ± 0.1V
Parameter
Symbol
667Mbs CL5
533Mbs CL4
400Mbs CL3
Unit
Min
Max
Min
Max
Min
Max
ODT
ODT tum-on delay
tAOND
222222
tCK
ODT turn-on
tAON
tAC(MIN)
tAC(MAX) +
1000
tAC(MIN)
tAC(MAX) +
1000
tAC(MIN)
tAC(MAX) +
1000
ps
ODT turn-off delay
tAOFD
2.5
tCK
ODT tum-off
tAOF
tAC(MIN)
tAC(MAX) +
600
tAC(MIN)
tAC(MAX) +
600
tAC(MIN)
tAC(MAX) +
600
ps
ODT tum-on (power-down mode)
tAONPD
tAC(MIN) +
2000
2 x tCK +
tAC(MAX) +
1000
tAC(MIN) +
2000
2 x tCK +
tAC(MAX) +
1000
tAC(MIN) +
2000
2 x tCK +
tAC(MAX) +
1000
ps
ODT turn-off (power-down mode)
tAOFPD
tAC(MIN) +
2000
2 x tCK +
tAC(MAX) +
1000
tAC(MIN) +
2000
2 x tCK +
tAC(MAX) +
1000
tAC(MIN) +
2000
2 x tCK +
tAC(MAX) +
1000
ps
ODT to power-down entry latency
tANPD
333
tCK
ODT power-down exit latency
tAXPD
888
tCK
Power-Down
Exit active power-down to READ command, MR[bit12=0]
tXARD
222
tCK
Exit active power-down to READ command, MR[bit12=1]
tXARDS
7-AL
6-AL
tCK
Exit precharge power-down to any non-READ command
tXP
222
tCK
CKE minimum high/low time
tCKE
333
tCK
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W3H32M72E-400SBC | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 400MHZ, 208PBGA COMMERICAL TEMP. - Bulk |
| W3H32M72E-400SBI | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 400MHZ, 208PBGA INDUSTRIAL TEMP. - Bulk |
| W3H32M72E-400SBM | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 400MHZ, 208PBGA MIL-TEMP. - Bulk |
| W3H32M72E-533ES | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M72E-533ESC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
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