參數(shù)資料
型號: W3H32M72E-400SB2M
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: DRAM
英文描述: 32M X 72 DDR DRAM, 0.6 ns, PBGA208
封裝: 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
文件頁數(shù): 17/25頁
文件大?。?/td> 1062K
代理商: W3H32M72E-400SB2M
W3H32M72E-XSB2X
November 2010 2010 Microsemi Corporation. All rights reserved.
24
Microsemi Corporation (602) 437-1520 www.whiteedc.com
Rev. 3
www.microsemi.com
Microsemi Corporation reserves the right to change products or specications without notice.
ORDERING INFORMATION
WHITE ELECTRONIC DESIGNS CORP.
(Microsemi Corporation)
DDR2 SDRAM
CONFIGURATION, 32M x 72
1.8V Power Supply
DATA RATE (Mbs)
400 = 400Mbs CL3
533 = 533Mbs CL4
667 = 667Mbs CL5
PACKAGE:
SB2 = 208 Plastic Ball Grid Array (PBGA)
DEVICE GRADE:
M = Military
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial 0°C to +70°C
W
3H
32M 72
E - XXX
SB2
X
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W3H32M72E-400SBC 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 400MHZ, 208PBGA COMMERICAL TEMP. - Bulk
W3H32M72E-400SBI 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 400MHZ, 208PBGA INDUSTRIAL TEMP. - Bulk
W3H32M72E-400SBM 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 400MHZ, 208PBGA MIL-TEMP. - Bulk
W3H32M72E-533ES 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M72E-533ESC 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package