參數(shù)資料
型號: uPD720114GA-YEU-A
廠商: NEC Corp.
英文描述: MOS INTEGRATED CIRCUIT
中文描述: 馬鞍山集成電路
文件頁數(shù): 29/32頁
文件大?。?/td> 269K
代理商: UPD720114GA-YEU-A
Data Sheet S17462EJ4V0DS
29
μ
PD720114
4.
RECOMMENDED SOLDERING CONDITIONS
The
μ
PD720114 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
μ
PD720114GA-9EU-A: 48-pin plastic TQFP (Fine pitch) (7 × 7)
μ
PD720114GA-YEU-A: 48-pin plastic TQFP (Fine pitch) (7 × 7)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Peak package’s surface temperature: 260 °C, Reflow time: 60 seconds or less
(220 °C or higher), Maximum allowable number of reflow processes: 3,
Exposure limit
afterwards),
Note
: 7 days (10 to 72 hours pre-backing is required at 125C°
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be baked
before unpacking.
IR60-107-3
Partial heating method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (per each side of the device) ,
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
Note
The Maximum number of days during which the product can be stored at a temperature of 5 to 25°C and a
relative humidity of 20 to 65% after dry-pack package is opened.
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