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參數(shù)資料
| 型號： | TSXPC603RCA10LC |
| 廠商： | ATMEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 233 MHz, RISC PROCESSOR, CQFP240 |
| 封裝： | CAVITY UP, CERQUAD-240 |
| 文件頁數(shù)： | 4/40頁 |
| 文件大?。?/td> | 670K |
| 代理商： | TSXPC603RCA10LC |
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12/40
TSPC603r
in CERQUAD and MQUAD Packages
3.4. Recommended Operating Conditions
These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed.
Parameter
Symbol
Min
Max
Unit
Core supply voltage
Vdd
2.375
2.625
V
PLL supply voltage
AVdd
2.375
2.625
V
I/O supply voltage
OVdd
3.135
3.465
V
Input voltage
Vin
GND
5.5
V
Case Operating temperature
Tc
-55
+125
°C
Junction operating temperature
Tj
+135
°C
3.5. Thermal characteristics
This section provides thermal management data for the 603r ; this information is based on a typical desktop configuration using a 240
lead, wire-bond CERQUAD and MQUAD packages with cavity up (silicon die is attached on the bottom of the package). This configu-
ration allows to dissipate through the PCB.
3.5.1.Generalities
The thermal characteristics for a wire-bond CERQUAD package are as follows :
Thermal resistance (junction-to-bottom of the case) (typical)= Rqjc or qjc = 2.5°C/Watt.
Thermal resistance (junction-to-top of the case) is typically 25
°C/W.
The thermal characteristics for the MQUAD package is :
Thermal resistance (junction-to-bottom of the case) (typical) = Rqjc or qjc = 1.3°C/Watt.
3.5.2.Thermal management example
The following example is based on a typical desktop configuration using a wire-bond package with cavity up (see 3.5.1).
The junction temperature can be calculated from the junction to ambient thermal resistance, as follows :
Junction temperature :
Tj = Tc + Rqjc * P
Tj = Ta + (Rcs + Rsa) * P + Rqjc * P
so
Tj = Ta + (Rqjc + Rcs + Rsa) * P
Where :
Ta is the ambient temperature in the vicinity of the device
Rqja is the junction-to-ambient thermal resistance
Rqjc is the junction-to-case thermal resistance of the device
Rcs is the case-to-heat sink thermal resistance of the interface material
Rsa is the heat sink-to-ambient thermal resistance
P is the power dissipated by the device
Because of the dissipation is made through the PCB, Rcs and Rsa are user values, and can vary considerably regarding the customer
application.
In a typical customer application, if Rcs is 0.5°C/W, Rsa is 3°C/W and Ta is 110°C, Tj can be estimated.
Tj = 110
°C + (2.5 + 0.5 +3) x 2.5 = 125°C.
Note that verification of external thermal resistance and case temperature should be performed for each application. Thermal resist-
ance can vary considerably due to many factors including degree of air turbulence.
3.6. Power consideration
The PowerPC603r is a microprocessor specifically designed for low-power operation. As the 603e microprocessor version, the 603r
provides both automatic and program-controllable power reduction modes for progressive reduction of power consumption. This
chapter describes the hardware support provided by the 603r for power management.
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