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參數(shù)資料
| 型號： | TPS2306EVM-001 |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 基準電壓源/電流源 |
| 英文描述： | TPS2306 Dual Sequencing Hot Swap Power Manager Evaluation Module and Interface Card(雙序列熱交換電源管理器件TPS2306的評估板與接口卡) |
| 中文描述： | TPS2306熱插拔雙測序電源管理評估模塊和接口卡（雙序列熱交換電源管理器件TPS2306的評估板與接口卡） |
| 文件頁數(shù)： | 4/19頁 |
| 文件大小： | 462K |
| 代理商： | TPS2306EVM-001 |
SLUU094
4
TPS2306 Dual Sequencing Hot Swap Power Manager
2
The TPS2306 EVM Kit
The TPS2306 EVM kit is a two-board platform that enables designers to rapidly learn about the TPS2306
operation, and evaluate its performance during hot swap actions. The hot swap board (TI part number
SLUP056) simulates the plug-in or module side of the power interface in a target hot-swappable system. It
contains the TPS2306 device, MOSFET switches, programming circuitry, and some load electronics. This board
is used in conjunction with the TPS2300 hot swap interface board (TI part number SLVP155). The interface card
simulates the backplane side of the system.
2.1
The TPS2306 Hot Swap EVM Board
2.1.1
Module Description
As supplied from the factory, the hot swap board is configured for a 5.0-V and 3.3-V system. By way of the P1
fingers connector and the interface card, 5.0-V power is applied to the HSPM Channel 1 controller, and 3.3-V
power is applied to Channel 2. The default configuration is set up for Channel 1 ramping up first, with Channel
2 ramp-up controlled by the Channel 1 output status. Turnoff sequencing is set up for Channel 2 turning off first,
with Channel 1 turnoff controlled by the Channel 2 output status. User modifications of the sequencing
programming is easily achieved via the installation and removal of the appropriate 0805 jumpers and resistors,
as described in Section 4.3 (Changing the Output Sequencing).
The Channel 1 constant-current mode level (IMAX1) has been set to 2.0 A; Channel 2 IMAX is preset to 4.0 A.
These thresholds are user-configurable; see Section 4.4 (Setting the Constant-Current Mode Output Level) for
details.
The hot swap EVM top layer assembly is shown in Figure 1.
Figure 1. Evaluation Module Top Assembly
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| TPS230QP | 制造商:Texas Instruments 功能描述: |
| TPS2310IPW | 功能描述:熱插拔功率分布 3-13V Dual w/Intrdpt Chl Circuit Breaking RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| TPS2310IPWG4 | 功能描述:熱插拔功率分布 3-13V Dual w/Intrdpt Chl Circuit Breaking RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| TPS2310IPWR | 功能描述:熱插拔功率分布 3-13V Dual w/Intrdpt Chl Circuit Breaking RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| TPS2310IPWRG4 | 功能描述:熱插拔功率分布 3-13V Dual w/Intrdpt Chl Circuit Breaking RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
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