參數(shù)資料
型號: STPCD0175BTI3
廠商: 意法半導(dǎo)體
元件分類: 微處理器
英文描述: PC Compatible Embedded Microprocessor
中文描述: PC兼容嵌入式微處理器
文件頁數(shù): 44/48頁
文件大?。?/td> 762K
代理商: STPCD0175BTI3
BOARD LAYOUT
44/48
Issue 1.7 - February 8, 2000
A local ground plane on opposite side of the board
as shown in Figure 6-6 improves thermal dissipa-
tion. It is used to connect decoupling capacitances
but can also be used for connection to a heat sink
or to the system’s metal box for better dissipation.
This possibility of using the whole system’s box for
thermal dissipation is very usefull in case of high
temperature inside the system and low tempera-
ture outside. In that case, both sides of the PBGA
should be thermally connected to the metal chas-
sis in order to propagate the heat through the met-
al. Figure 6-7 illustrates such an implementation.
Figure 6-6. Bottom side layout and decoupling
Ground plane for thermal dissipation
Via to ground layer
Figure 6-7. Use of metal plate for thermal dissipation
Metal planes
Thermal conductor
Board
Die
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