參數(shù)資料
型號(hào)： STPCD0175BTI3
廠商： 意法半導(dǎo)體
元件分類： 微處理器
英文描述： PC Compatible Embedded Microprocessor
中文描述： PC兼容嵌入式微處理器
文件頁數(shù)： 43/48頁
文件大?。?/td> 762K
代理商： STPCD0175BTI3
BOARD LAYOUT
Issue 1.7 - February 8, 2000
43/48
The PBGA Package also dissipates heat through
peripheral ground balls. When a heat sink is
placed on the device, heat is more uniformely
spread throughout the moulding increasing heat
dissipation through the peripheral ground balls.
The more via pads are connected to each ground
ball, the more heat is dissipated . The only limita-
tion is the risk of lossing routing channels.
Figure 6-5 shows a routing with a good trade off
between thermal dissipation and number of rout-
ing channels.
Figure 6-4. Optimum layout for central ground ball
Via to Ground layer
hole diameter = 14 mil
Pad for ground ball
diameter = 25 mil
connections = 10 mil
Clearance = 6mil
External diameter = 37 mil
Solder mask
diameter = 33 mil
Figure 6-5. Global ground layout for good thermal dissipation
Ground pad
Via to ground layer
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