參數(shù)資料
型號(hào): STPCD0175BTI3
廠商: 意法半導(dǎo)體
元件分類: 微處理器
英文描述: PC Compatible Embedded Microprocessor
中文描述: PC兼容嵌入式微處理器
文件頁(yè)數(shù): 39/48頁(yè)
文件大?。?/td> 762K
代理商: STPCD0175BTI3
MECHANICAL DATA
Issue 1.7 - February 8, 2000
39/48
Figure 5-6. Thermal dissipation with heatsink
Board
Ambient
Case
Junction
Board
Ambient
Ambient
Case
50
Junction
Board
Rca
Rjc
Rjb
Rba
3
6
8.5
Rja = 9.5
°
C/W
Airflow = 0
Board temperature taken at the center balls
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centered on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17
μ
m for internal layers
- 34
μ
m for external layers
Heat sink is 11.1
°
C/W
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