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參數(shù)資料
| 型號： | STPCD0175BTI3 |
| 廠商： | 意法半導(dǎo)體 |
| 元件分類： | 微處理器 |
| 英文描述： | PC Compatible Embedded Microprocessor |
| 中文描述： | PC兼容嵌入式微處理器 |
| 文件頁數(shù)： | 42/48頁 |
| 文件大?。?/td> | 762K |
| 代理商： | STPCD0175BTI3 |
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BOARD LAYOUT
42/48
Issue 1.7 - February 8, 2000
When considering thermal dissipation, the most
important - and not the more obvious - part of the
layout is the connection between the ground balls
and the ground layer.
A 1-wire connection is shown in Figure 6-2. The
use of a 8-mil wire results in a thermal resistance
of 105
°
C/W assuming copper is used (418 W/
m.
°
K). This high value is due to the thickness (34
μ
m) of the copper on theexternal side of the PCB.
Considering only the central matrix of 36 thermal
balls and one via for each ball, the global thermal
resistance is 2.9
°
C/W. This can be easily im-
proved by using four 10 milwires to connect to the
four vias around the ground pad link as in Figure
6-3. This gives a total of 49 vias and a global resis-
tance for the 36 thermal balls of 0.6
°
C/W.
The use of a ground plane like in Figure 6-4 is
even better.
To avoid solder wickingover to the via padsduring
soldering, it is important to have a solder mask of
4 mil around the pad (NSMD pad), this gives a di-
ameter of 33mil for a 25 mil ground pad.
To obtain the optimum ground layout, place the
vias directly under the ball pads. In this case no lo-
cal boar d distortion is tolerated.
The thickness of the copper on PCB layers is typ-
ically 34
μ
m for external layers and 17
μ
m for inter-
nal layers. This means thermal dissipation is not
good and temperature of the board is concentrat-
ed around the devices and falls quickly with in-
creased distance.
When it is possible to place a metal layer inside
the PCB, this improves dramatically the heat
spreading and hence thermal dissipation of the
board.
Figure 6-2. Recommended 1-wire ground pad layout
Figure 6-3. Recommended 4-wire ground pad layout
Solder Mask (4 mil)
Pad for ground ball (diameter = 25 mil)
Hole to ground layer (diameter = 12 mil)
Connection Wire (width = 10 mil)
Via (diameter = 24 mil)
345ml
1 mil = 0.0254 mm
4 via pads for each ground ball
相關(guān)PDF資料 |
PDF描述 |
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| STPD0175BTI3 | PC Compatible Embedded Microprocessor |
| STPD0166BTA3 | RP15 (F) Series - Powerline Regulated DC-DC Converters; Input Voltage (Vdc): 12V; Output Voltage (Vdc): 3.3V; 2:1 Wide Input Voltage Range; 15 Watts Output Power; 1.6kVDC Isolation; UL Certified; Fixed Operating Frequency; Six-Sided Continuous Shield; Standard 50.8 x25.4x10.2mm Package; Efficiency to 88% |
| STPD0175BTA3 | PC Compatible Embedded Microprocessor |
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| STPCE1 | STPC ELITE DATASHEET / X86 CORE GENERAL PURPOSE PC COMPATIBLE SYSTEM ON CHIP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| STPCE1 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:STPC ELITE DATASHEET / X86 CORE GENERAL PURPOSE PC COMPATIBLE SYSTEM ON CHIP |
| STPCE1DDBC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| STPCE1DDBI | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| STPCE1EDBC | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1EDBI | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
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