參數(shù)資料
型號(hào)： STPCD0175BTI3
廠商： 意法半導(dǎo)體
元件分類： 微處理器
英文描述： PC Compatible Embedded Microprocessor
中文描述： PC兼容嵌入式微處理器
文件頁數(shù)： 38/48頁
文件大?。?/td> 762K
代理商： STPCD0175BTI3
MECHANICAL DATA
38/48
Issue 1.7 - February 8, 2000
5.2 388-Pin Package thermal data
388-pin PBGA package has a Power Dissipation
Capability of 4.5W which increases to 6W when
used with a Heatsink.
Structure in shown in Figure 5-4.
Thermal dissipation options are illustrated in Fig-
ure 5-5 and Figure 5-6.
Figure 5-4. 388-Pin PBGA structure
Thermal balls
Power & Ground layers
Signal layers
Figure 5-5. Thermal dissipation without heatsink
Ambient
Board
Case
Junction
Board
Ambient
Ambient
Case
125
Junction
Board
Rca
Rjc
Rjb
Rba
6
6
8.5
Rja = 13
°
C/W
Airflow = 0
Board temperature taken at the center balls
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centered on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17
μ
m for internal layers
- 34
μ
m for external layers
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STPD0175BTI3 PC Compatible Embedded Microprocessor
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