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參數資料
| 型號： | SSTUA32864EC,557 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 鎖存器 |
| 英文描述： | SSTU SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA96 |
| 封裝： | 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-536-1, LFBGA-96 |
| 文件頁數： | 8/20頁 |
| 文件大小： | 117K |
| 代理商： | SSTUA32864EC,557 |
SSTUA32864_2
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 9 March 2007
16 of 20
NXP Semiconductors
SSTUA32864
1.8 V congurable registered buffer for DDR2-667 RDIMM applications
13.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 17) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 10 and 11
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 17.
Table 10.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 11.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關代理商/技術參數 |
參數描述 |
|---|---|
| SSTUA32864EG | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.8 V configurable registered buffer for DDR2-667 RDIMM applications |
| SSTUA32866 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-667 RDIMM applications |
| SSTUA32866BHLF | 功能描述:IC REGIST BUFFER 25BIT DDR 96BGA RoHS:是 類別:集成電路 (IC) >> 邏輯 - 專用邏輯 系列:- 產品變化通告:Product Discontinuation 25/Apr/2012 標準包裝:1,500 系列:74SSTV 邏輯類型:DDR 的寄存緩沖器 電源電壓:2.3 V ~ 2.7 V 位數:14 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:48-TFSOP（0.240"，6.10mm 寬） 供應商設備封裝:48-TSSOP 包裝:帶卷 (TR) |
| SSTUA32866BHLFT | 功能描述:IC REGIST BUFFER 25BIT DDR 96BGA RoHS:是 類別:集成電路 (IC) >> 邏輯 - 專用邏輯 系列:- 產品變化通告:Product Discontinuation 25/Apr/2012 標準包裝:1,500 系列:74SSTV 邏輯類型:DDR 的寄存緩沖器 電源電壓:2.3 V ~ 2.7 V 位數:14 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:48-TFSOP（0.240"，6.10mm 寬） 供應商設備封裝:48-TSSOP 包裝:帶卷 (TR) |
| SSTUA32866BHMLF | 制造商:Integrated Device Technology Inc 功能描述:REGISTERED BFFR SGL 25-CH CMOS 96TFBGA - Bulk |
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