參數(shù)資料
型號(hào)： SSTUA32864EC,557
廠商： NXP SEMICONDUCTORS
元件分類(lèi)： 鎖存器
英文描述： SSTU SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA96
封裝： 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-536-1, LFBGA-96
文件頁(yè)數(shù)： 12/20頁(yè)
文件大?。?/td> 117K
代理商： SSTUA32864EC,557
SSTUA32864_2
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 9 March 2007
2 of 20
NXP Semiconductors
SSTUA32864
1.8 V congurable registered buffer for DDR2-667 RDIMM applications
2.
Features
I Congurable register supporting DDR2 Registered DIMM applications
I Congurable to 25-bit 1 : 1 mode or 14-bit 1 : 2 mode
I Controlled output impedance drivers enable optimal signal integrity and speed
I Exceeds SSTUA32864 JEDEC specication speed performance (1.8 ns max.
single-bit switching propagation delay; 2.0 ns max. mass-switching)
I Supports up to 450 MHz clock frequency of operation
I Optimized pinout for high-density DDR2 module design
I Chip-selects minimize power consumption by gating data outputs from changing state
I Supports SSTL_18 data inputs
I Differential clock (CK and CK) inputs
I Supports LVCMOS switching levels on the control and RESET inputs
I Single 1.8 V supply operation (1.7 V to 2.0 V)
I Available in 96-ball, 13.5 mm × 5.5 mm, 0.8 mm ball pitch LFBGA package
3.
Applications
I 400 MT/s to 667 MT/s DDR2 registered DIMMs without parity
4.
Ordering information
Table 1.
Ordering information
Tamb =0 °Cto+70 °C.
Type number
Solder process
Package
Name
Description
Version
SSTUA32864EC/G
Pb-free (SnAgCu
solder ball compound)
LFBGA96
plastic low prole ne-pitch ball grid array package;
96 balls; body 13.5
× 5.5 × 1.05 mm
SOT536-1
SSTUA32864EC
SnPb solder ball
compound
LFBGA96
plastic low prole ne-pitch ball grid array package;
96 balls; body 13.5
× 5.5 × 1.05 mm
SOT536-1
相關(guān)PDF資料
PDF描述
SSTUA32866EC/G 32866 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PBGA96
SSTUA32866EC,557 32866 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PBGA96
SSTUA32866EC/G,551 32866 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PBGA96
SSTUA32866EC/G,557 32866 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PBGA96
SSTUAF32866BHLFT 32866 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA96
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SSTUA32864EG 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:1.8 V configurable registered buffer for DDR2-667 RDIMM applications
SSTUA32866 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-667 RDIMM applications
SSTUA32866BHLF 功能描述:IC REGIST BUFFER 25BIT DDR 96BGA RoHS:是 類(lèi)別:集成電路 (IC) >> 邏輯 - 專(zhuān)用邏輯 系列:- 產(chǎn)品變化通告:Product Discontinuation 25/Apr/2012 標(biāo)準(zhǔn)包裝:1,500 系列:74SSTV 邏輯類(lèi)型:DDR 的寄存緩沖器 電源電壓:2.3 V ~ 2.7 V 位數(shù):14 工作溫度:0°C ~ 70°C 安裝類(lèi)型:表面貼裝 封裝/外殼:48-TFSOP（0.240"，6.10mm 寬） 供應(yīng)商設(shè)備封裝:48-TSSOP 包裝:帶卷 (TR)
SSTUA32866BHLFT 功能描述:IC REGIST BUFFER 25BIT DDR 96BGA RoHS:是 類(lèi)別:集成電路 (IC) >> 邏輯 - 專(zhuān)用邏輯 系列:- 產(chǎn)品變化通告:Product Discontinuation 25/Apr/2012 標(biāo)準(zhǔn)包裝:1,500 系列:74SSTV 邏輯類(lèi)型:DDR 的寄存緩沖器 電源電壓:2.3 V ~ 2.7 V 位數(shù):14 工作溫度:0°C ~ 70°C 安裝類(lèi)型:表面貼裝 封裝/外殼:48-TFSOP（0.240"，6.10mm 寬） 供應(yīng)商設(shè)備封裝:48-TSSOP 包裝:帶卷 (TR)
SSTUA32866BHMLF 制造商:Integrated Device Technology Inc 功能描述:REGISTERED BFFR SGL 25-CH CMOS 96TFBGA - Bulk
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