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參數(shù)資料
| 型號： | SST32HF202-70-4C-L3KE |
| 廠商： | SILICON STORAGE TECHNOLOGY INC |
| 元件分類： | 存儲器 |
| 英文描述： | Multi-Purpose Flash (MPF) + SRAM ComboMemory |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA48 |
| 封裝： | 6 X 8 MM, 1.40 HEIGHT, ROHS COMPLIANT, MO-210AB-1, LFBGA-48 |
| 文件頁數(shù)： | 5/30頁 |
| 文件大?。?/td> | 399K |
| 代理商： | SST32HF202-70-4C-L3KE |
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Data Sheet
Multi-Purpose Flash (MPF) + SRAM ComboMemory
SST32HF202 / SST32HF402 / SST32HF802
5
2005 Silicon Storage Technology, Inc.
S71209-06-000
5/05
Product Identification
The Product Identification mode identifies the devices as
the SST32HF202/402/802 and manufacturer as SST.
This
mode may be accessed by software operations only.
The hardware device ID Read operation, which is typi-
cally used by programmers, cannot be used on this
device because of the shared lines between flash and
SRAM in the multi-chip package. Therefore, applica-
tion of high voltage to pin A
9
may damage this device.
Users may use the software Product Identification opera-
tion to identify the part (i.e., using the device ID) when using
multiple manufacturers in the same socket. For details, see
Tables 3 and 4 for software operation, Figure 14 for the
software ID entry and Read timing diagram, and Figure 20
for the ID entry command sequence flowchart.
Product Identification Mode Exit/Reset
In order to return to the standard read mode, the Software
Product Identification mode must be exited. Exiting is
accomplished by issuing the Exit ID command sequence,
which returns the device to the Read operation. Please
note that the software reset command is ignored during an
internal Program or Erase operation. See Table 4 for soft-
ware command codes, Figure 15 for timing waveform and
Figure 20 for a flowchart.
Design Considerations
SST recommends a high frequency 0.1 μF ceramic capac-
itor to be placed as close as possible between V
DD
and
V
SS
, e.g., less than 1 cm away from the V
DD
pin of the
device. Additionally, a low frequency 4.7 μF electrolytic
capacitor from V
DD
to V
SS
should be placed within 1 cm of
the V
DD
pin.
TABLE
1: P
RODUCT
I
DENTIFICATION
Address
0000H
Data
00BFH
Manufacturer’s ID
Device ID
SST32HF202
SST32HF402
SST32HF802
0001H
0001H
0001H
2789H
2780H
2781H
T1.2 1209
I/O Buffers
1209 B1.0
Address Buffers
DQ15 - DQ8
DQ7 - DQ0
AMS-A0
WE#
SuperFlash
Memory
SRAM
Control Logic
BES#
BEF#
OE#
Address Buffers
& Latches
LBS#
UBS#
F
UNCTIONAL
B
LOCK
D
IAGRAM
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| SST34HF1601-90-4C-L1P | 16 Mbit Concurrent SuperFlash + 8 Mbit SRAM ComboMemory |
| SST34HF1602D-70-4C-B1PE | 16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| SST32HF202-70-4E-L3K | 功能描述:組合存儲器 2M FLASH 2M SRAM RoHS:否 制造商:Microchip Technology 組織:512 K x 16 電源電壓-最大: 電源電壓-最小: 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:LFBGA-48 封裝:Tray |
| SST32HF202-70-4E-L3KE | 功能描述:組合存儲器 2M FLASH 2M SRAM RoHS:否 制造商:Microchip Technology 組織:512 K x 16 電源電壓-最大: 電源電壓-最小: 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:LFBGA-48 封裝:Tray |
| SST32HF202-90-4C-L3K | 功能描述:組合存儲器 2M FLASH 2M SRAM RoHS:否 制造商:Microchip Technology 組織:512 K x 16 電源電壓-最大: 電源電壓-最小: 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:LFBGA-48 封裝:Tray |
| SST32HF202-90-4C-L3KE | 功能描述:組合存儲器 2M FLASH 2M SRAM RoHS:否 制造商:Microchip Technology 組織:512 K x 16 電源電壓-最大: 電源電壓-最小: 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:LFBGA-48 封裝:Tray |
| SST32HF202-90-4E-L3K | 功能描述:組合存儲器 2M FLASH 2M SRAM RoHS:否 制造商:Microchip Technology 組織:512 K x 16 電源電壓-最大: 電源電壓-最小: 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:LFBGA-48 封裝:Tray |
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