參數(shù)資料
型號: SM3-19.44M
廠商: Connor-Winfield
文件頁數(shù): 26/36頁
文件大?。?/td> 0K
描述: IC MOD TIMING 19.440MHZ STATUM 3
標準包裝: 1
系列: SM3
類型: 定時模塊,系統(tǒng)時鐘
PLL:
主要目的: 以太網(wǎng),ADM,DSLAM,SONET/SDH,Stratum,TDM
輸入: LVCMOS
輸出: LVCMOS
電路數(shù): 1
比率 - 輸入:輸出: 4:3
差分 - 輸入:輸出: 無/無
頻率 - 最大: 19.44MHz
電源電壓: 3.135 V ~ 3.465 V
工作溫度: 0°C ~ 70°C
安裝類型: 通孔
封裝/外殼: 32-DIP 模塊
包裝: 管件
其它名稱: CW642
SM3 19.44M
SM319.44M
SM3 Data Sheet #:
TM052
Page 32 of 36 Rev: 06 Date:01/26/11
Copyright 2011 The Connor-Winfield Corp. All Rights Reserved
Specifications subject to change without notice
Optional SM3/SM3E Dual Footprint
SM3
SM3E
1
14
15
LOS
LOL
M/S REF
REF1
REF2
REF3
REF4
TDI
TMS
TRST
BITS_CLK
M/S_OUT
OUTPUT1
VPP
REF5
REF6
MASTER SELECT
SPI_INT
SPI_OUT
RESET
SPI_ENBL
Vcc
SPI_IN
SPI_CLK
GND
TCK
TDO
HOLD_GOOD
T1/E1
VPN
REF7
REF8
2
3
4
5
6
7
8
9
10
11
12
13
16
17
18
19
20
21
22
23
24
25
26
27
28
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
0.850"
1.100"
(TOP VIEW)
A dual footprint configuration may be used when designing a host circuit board containing the Connor Winfield SM3 or SM3E modules.
The smaller SM3 contains a subset of the signal pins found on the larger SM3E in locations which allow for a simple dual footprint
arrangement like the one shown in Figure 13.
The modules shown in Figure 13 are arranged in a left-justified fashion. Notice that right justified or center justified (with an additional
column of SM3 pins) arrangements are also possible, depending on the designer’s preference.
Placement of external components
1.
Place series resistors (33 ohms) at the source of all reference inputs (SM3 Pins 4 - 7, SM3E Pins 4-7 & 15-18).
2.
Place series resistors (33 ohms) at the source of SPI_IN and SPI_CLK inputs (SM3 Pins 21,22, SM3E Pins 25 & 26).
3.
Place one .01uF and one 47-100uF capacitor at the input power pin (SM3 Pin 23, SM3E Pin 27).
4.
One 4.7uF (25V) capacitor is required at the VPP pin (SM3 & SM3E Pin 14).
5.
One 4.7uF (25V) capacitor is required at the VPN pin (SM3 Pin 15, SM3E Pin 19).
Be sure to consult Connor Winfield’s respective datasheets for additional mechanical, electrical, footprint and keep-out information.
Figure 13
Application Notes continued
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