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參數(shù)資料
| 型號(hào)： | SM3-19.44M |
| 廠商： | Connor-Winfield |
| 文件頁數(shù)： | 25/36頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MOD TIMING 19.440MHZ STATUM 3 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | SM3 |
| 類型： | 定時(shí)模塊，系統(tǒng)時(shí)鐘 |
| PLL： | 是 |
| 主要目的： | 以太網(wǎng)，ADM，DSLAM，SONET/SDH，Stratum，TDM |
| 輸入： | LVCMOS |
| 輸出： | LVCMOS |
| 電路數(shù)： | 1 |
| 比率 - 輸入:輸出： | 4:3 |
| 差分 - 輸入:輸出： | 無/無 |
| 頻率 - 最大： | 19.44MHz |
| 電源電壓： | 3.135 V ~ 3.465 V |
| 工作溫度： | 0°C ~ 70°C |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 32-DIP 模塊 |
| 包裝： | 管件 |
| 其它名稱： | CW642 SM3 19.44M SM319.44M |
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SM3 Data Sheet #:
TM052
Page 31 of 36 Rev: 06 Date: 01/26/11
Copyright 2011 The Connor-Winfield Corp. All Rights Reserved
Specifications subject to change without notice
Required External Components
1.
Place series resistors (33 ohms) on all reference inputs (Pins 4 - 7).
2.
Place series resistors (33 ohms) on SPI_IN and SPI_CLK inputs (Pins 21, 22).
3.
Place one .01uF and one 47-100uF capacitor at the input power pin (Pin 23).
PCB Layout Recommendations
1.
Orient module so airflow is parallel along the header strips (pins).
2.
Place de-coupling and/or filter components as close to module pins as possible.
3.
Do not place any components directly beneath the module on the topside of the host PCB.
4.
Ensure that only clean and well-regulated power is supplied to the module.
5.
Isolate power and ground inputs to the module from noisy sources.
6.
Provide power and ground connections through a 0.050” wide trace (minimum) using 1-oz. Cu or equivalent copper feature (i.e.
internal plane, copper area fill, etc.).
7.
Keep module signals away from sensitive or noisy analog and digital circuitry.
8.
Avoid split ground planes as high-frequency return currents may be affected.
9.
Allow extra spacing between traces of high-frequency inputs and outputs.
10. Keep all traces as short as possible - avoid meandering trace paths.
11. Avoid routing signals directly beneath the module on the topside of the host PCB.
12. If possible, provide a copper area directly beneath the module on the topside of the host PCB. Connect this copper area to
ground.
13. It is recommended that the connections of the JTAG, VPP and VPN pins be routed to pads, preferably in a SIL pattern as shown
in Figure 12 below. It is recommended to use 0.1” center to center spacing.
Optional Socket Mounting Recommendations
Mating sockets may be used if permanent installation of the SM3 module is not desired. Two possible sources for these sockets
include:
1.
Samtec, “Low Profile Socket Strips”, SL Series, PN SL-114-G-19. (http://www.samtec.com/)
2.
Mill-Max, “Single-In-Line Sockets”, 315 Series, PN 315-xx-114-41-001. (http://www.mill-max.com/)
The SM3 requires two 14-pin sockets. The optional dual footprint configuration shown in Figure 13 requires one 14-pin and two 16-pin
sockets.
Application Notes continued
1
8
V
PP
V
PN
GND
TCK
TDI
TDO
TM
S
RCK
Figure 12
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