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參數(shù)資料
| 型號(hào)： | SAF7849HL |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類(lèi)： | 存儲(chǔ)器 |
| 英文描述： | One chip CD audio device with integrated MP3-WMA decoder |
| 封裝： | SAF7843HL/M295<SOT486-1 (LQFP144)|<<http://www.nxp.com/packages/SOT486-1.html<1<Always Pb-free,;SAF7849HL/M245<SOT486-1 (LQFP144)|<<http://www.nxp.com/packages/SOT486-1.h |
| 文件頁(yè)數(shù)： | 86/93頁(yè) |
| 文件大?。?/td> | 396K |
| 代理商： | SAF7849HL |
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SAF784X_2
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 9 May 2008
86 of 93
NXP Semiconductors
SAF784x
One chip CD audio device with integrated MP3/WMA decoder
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 42
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 19
and
20
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 42
.
Table 19.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Table 20.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SAF7849HL/M245,557 | 功能描述:音頻 DSP IC AUD DECODER RoHS:否 制造商:Texas Instruments 工作電源電壓: 電源電流: 工作溫度范圍: 安裝風(fēng)格: 封裝 / 箱體: 封裝:Tube |
| SAF7849HL/M295,557 | 功能描述:音頻 DSP IC AUD DECODER RoHS:否 制造商:Texas Instruments 工作電源電壓: 電源電流: 工作溫度范圍: 安裝風(fēng)格: 封裝 / 箱體: 封裝:Tube |
| SAF7860HL/M2,557 | 制造商:NXP Semiconductors 功能描述:DSP |
| SAF82520PVB2 | 制造商:SIEMENS 功能描述:New |
| SAF82525 | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:Data Communications ICs |
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