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參數(shù)資料
| 型號： | SAA4978 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Picture Improved Combined Network PICNIC |
| 中文描述： | 圖片改進聯(lián)合網絡野餐 |
| 文件頁數(shù)： | 54/56頁 |
| 文件大?。?/td> | 296K |
| 代理商： | SAA4978 |
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1999 May 03
54
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SAA4978H
14.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable
(2)
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
suitable
suitable
suitable
suitable
suitable
suitable
not recommended
(3)(4)
not recommended
(5)
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PDF描述 |
|---|---|
| SAA4978H | Picture Improved Combined Network PICNIC |
| SAA4979H | Sample rate converter with embedded high quality dynamic noise reduction and expansion port |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| SAA4978H | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Picture Improved Combined Network PICNIC |
| SAA4979H | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Sample rate converter with embedded high quality dynamic noise reduction and expansion port |
| SAA4981 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Monolithic integrated 16 : 9 compressor |
| SAA4981T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Monolithic integrated 16 : 9 compressor |
| SAA4990 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Progressive scan-Zoom and Noise reduction IC PROZONIC |
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