參數(shù)資料
型號: SAA4978
廠商: NXP Semiconductors N.V.
英文描述: Picture Improved Combined Network PICNIC
中文描述: 圖片改進(jìn)聯(lián)合網(wǎng)絡(luò)野餐
文件頁數(shù): 52/56頁
文件大小: 296K
代理商: SAA4978
1999 May 03
52
Philips Semiconductors
Product specification
Picture Improved Combined Network
(PICNIC)
SAA4978H
13 PACKAGE OUTLINE
UNIT
A
1
A
2
A
3
b
p
c
E
(1)
(1)
(1)
e
H
E
L
L
p
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
0.50
0.25
3.70
3.15
0.25
0.38
0.22
0.23
0.13
28.1
27.9
0.65
0.3
1.6
1.5
1.1
7
0
o
o
0.15
0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.03
0.73
SOT322-2
MO112DD1
96-03-14
97-08-04
D
(1)
28.1
27.9
H
D
31.45
30.95
31.45
30.95
E
Z
1.5
1.1
D
pin 1 index
b
p
e
θ
E
A
1
A
L
p
detail X
L
(A )
3
B
40
c
D
H
b
p
E
H
A
2
v
M
B
D
ZD
A
ZE
e
v
M
A
X
1
160
121
120
81
80
41
y
w
M
w
M
0
5
10 mm
scale
SOT322-2
160 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm; high stand-off height
QFP160: plastic quad flat package;
A
max.
4.07
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