參數(shù)資料
型號: S71GL256NB0
廠商: Spansion Inc.
英文描述: Stacked Multi-chip Product (MCP)
中文描述: 堆疊式多芯片產(chǎn)品(MCP)
文件頁數(shù): 124/147頁
文件大?。?/td> 1655K
代理商: S71GL256NB0
124
pSRAM Type 1
pSRAM_Type01_12_A1 August 30, 2004
A d v a n c e I n f o r m a t i o n
Address Patterns for PASR (A4=1) (64M)
Deep ICC Characteristics (for 64Mb)
Address Patterns for PAR (A3= 0, A4=1) (32M)
A2
A1
A0
Active Section
Address Space
Size
Density
1
1
1
Top quarter of die
300000h-3FFFFFh
1Mb x 16
16Mb
1
1
0
Top half of die
200000h-3FFFFFh
2Mb x 16
32Mb
1
0
1
Reserved
1
0
0
No PASR
None
0
0
0
1
1
Bottom quarter of die
000000h-0FFFFFh
1Mb x 16
16Mb
0
1
0
Bottom half of die
000000h-1FFFFFh
2Mb x 16
32Mb
0
0
1
Reserved
0
0
0
Full array
000000h-3FFFFFh
4Mb x 16
64Mb
Item
Symbol
Test
Array Partition
Typ
Max
Unit
PASR Mode Standby Current
I
PASR
V
IN
= V
CC
or 0V, Chip Disabled, t
A
= 85°C
None
10
μA
1/4 Array
60
1/2 Array
80
Full Array
120
Item
Symbol
Max Temperature
Typ
Max
Unit
Temperature Compensated Refresh Current
I
TCR
15°C
50
μA
45°C
60
70°C
80
85°C
120
Item
Symbol
Test
Typ
Max
Unit
Deep Sleep Current
I
ZZ
V
IN
= V
CC
or 0V, Chip in ZZ# mode, t
A
= 25°C
10
μA
A2
A1
A0
Active Section
Address Space
Size
Density
0
1
1
One-quarter of die
000000h - 07FFFFh
512Kb x 16
8Mb
0
1
0
One-half of die
000000h - 0FFFFFh
1Mb x 16
16Mb
x
0
0
Full die
000000h - 1FFFFFh
2Mb x 16
32Mb
1
1
1
One-quarter of die
180000h - 1FFFFFh
512Kb x 16
8Mb
1
1
0
One-half of die
100000h - 1FFFFFh
1Mb x 16
16Mb
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