參數(shù)資料
型號: S71GL128NB0
廠商: Spansion Inc.
英文描述: Stacked Multi-chip Product (MCP)
中文描述: 堆疊式多芯片產(chǎn)品(MCP)
文件頁數(shù): 95/147頁
文件大?。?/td> 1655K
代理商: S71GL128NB0
June 14, 2004 S29GLxxxN_00_A4
S29GLxxxN MirrorBit
TM
Flash Family
95
A d v a n c e I n f o r m a t i o n
AC Characteristics
Latchup Characteristics
Note:
Includes all pins except V
CC
. Test conditions: V
CC
= 3.0 V, one pin at a time.
Description
Min
Max
Input voltage with respect to V
SS
on all pins except I/O pins
(including A9, OE#, and RESET#)
–1.0 V
12.5 V
Input voltage with respect to V
SS
on all I/O pins
–1.0 V
V
CC
+ 1.0 V
V
CC
Current
–100 mA
+100 mA
t
GHEL
t
WS
OE#
CE#
WE#
RESET#
t
DS
Data
t
AH
Addresses
t
DH
t
CP
DQ7#
D
OUT
t
WC
t
AS
t
CPH
PA
Data# Polling
A0 for program
55 for erase
t
RH
t
WHWH1 or 2
RY/BY#
t
WH
PD for program
30 for sector erase
10 for chip erase
555 for program
2AA for erase
PA for program
SA for sector erase
555 for chip erase
t
BUSY
Notes:
1. Figure indicates last two bus cycles of a program or erase operation.
2. PA = program address, SA = sector address, PD = program data.
3. DQ7# is the complement of the data written to the device. D
OUT
is the data written to the device.
4. Waveforms are for the word mode.
Figure 20. Alternate CE# Controlled Write (Erase/Program)
Operation Timings
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