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參數(shù)資料
| 型號： | PowerNP NPe405L |
| 廠商： | IBM Microeletronics |
| 英文描述： | 32-Bit Embedded Processor(32位嵌入式處理器) |
| 中文描述： | 32位嵌入式處理器（32位嵌入式處理器） |
| 文件頁數(shù)： | 34/48頁 |
| 文件大?。?/td> | 741K |
| 代理商： | POWERNP NPE405L |
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Advance Information
PowerNP
TM
NPe405L Embedded Processor Data Sheet
34
Notes:
1. For a chip mounted on a JEDEC 2S2P card without a heat sink.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
a. Case temperature, T
C
, is measured at top center of case surface with device soldered to circuit board.
b. T
A
= T
C
– P
×θ
CA
, where T
A
is ambient temperature and P is power consumption.
c. T
CMax
= T
JMax
– P
×θ
JC
, where T
JMax
is maximum junction temperature and P is power consumption.
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device.
Characteristic
Symbol
Value
Unit
Supply Voltage (Internal Logic)
V
DD
0 to 2.7
V
Supply Voltage (I/O Interface)
OV
DD
0 to 3.6
V
PLL Supply Voltage
AV
DD
0 to 2.7
V
Input Voltage (3.3V LVTTL receivers)
V
IN
0 to 3.6
V
Input Voltage (5.0V LVTTL receivers)
V
IN
0 to 5.5
V
Storage Temperature Range
T
STG
-55 to 150
°
C
Case temperature under bias
T
C
-40 to +120
°
C
Package Thermal Specifications
The NPe405L is designed to operate within a case temperature range of -40C to 120C. Thermal resistance values for
the E-PBGA packages in a convection environment are as follows:
Package—Thermal Resistance
Symbol
Airflow
ft/min (m/sec)
Unit
0 (0)
100 (0.51)
200 (1.02)
23mm, 324-balls—Junction-to-Case
θ
JC
θ
CA
°C/W
23mm, 324-balls—Case-to-Ambient
1
°C/W
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