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| 型號： | PCA9698 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 40-bit Fm+ I2C-bus advanced I/O port with RESET, OE and INT |
| 中文描述： | 40位調(diào)頻I2C總線先進的I / O復(fù)位，光電和INT端口 |
| 文件頁數(shù)： | 42/47頁 |
| 文件大小： | 214K |
| 代理商： | PCA9698 |
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PCA9698_2
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 19 July 2006
42 of 47
Philips Semiconductors
PCA9698
40-bit Fm+ I
2
C-bus advanced I/O port with RESET, OE and INT
15. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
16. Soldering
16.1 Introduction to soldering surface mount packages
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
16.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow temperatures range from 215
°
C to 260
°
C depending on solder paste
material. The peak top-surface temperature of the packages should be kept below:
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
16.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
Table 16.
SnPb eutectic process - package peak reflow temperatures (from J-STD-020C
July 2004)
Package thickness
Volume mm
3
< 350
< 2.5 mm
240
°
C + 0/
5
°
C
≥
2.5 mm
225
°
C + 0/
5
°
C
Volume mm
3
≥
350
225
°
C + 0/
5
°
C
225
°
C + 0/
5
°
C
Table 17.
Pb-free process - package peak reflow temperatures (from J-STD-020CJuly
2004)
Package thickness
Volume mm
3
< 350
Volume mm
3
350 to
2000
260
°
C + 0
°
C
250
°
C + 0
°
C
245
°
C + 0
°
C
Volume mm
3
> 2000
< 1.6 mm
1.6 mm to 2.5 mm
≥
2.5 mm
260
°
C + 0
°
C
260
°
C + 0
°
C
250
°
C + 0
°
C
260
°
C + 0
°
C
245
°
C + 0
°
C
245
°
C + 0
°
C
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| PCA9698BS | 制造商:NXP Semiconductors 功能描述:IC IO EXPANDER 40BIT I2C 5 制造商:NXP Semiconductors 功能描述:IC, IO EXPANDER, 40BIT, I2C, 56HVQFN 制造商:NXP Semiconductors 功能描述:IC, IO EXPANDER, 40BIT, I2C, 56HVQFN; Chip Configuration:40bit; Bus Frequency:1MHz; Interface Type:I2C, SMBus; Supply Voltage Min:2.3V; Supply Voltage Max:5.5V; Digital IC Case Style:HVQFN; No. of Pins:56; No. of I/O's:40; MSL:MSL 1 ;RoHS Compliant: Yes |
| PCA9698BS,118 | 功能描述:接口-I/O擴展器 I2C I/O EXPANDER GP RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9698BS,118-CUT TAPE | 制造商:NXP 功能描述:PCA9698 Series 40-Bit Fm I2C-Bus Advanced I/O Port w/ Reset - HVQFN 56 |
| PCA9698DGG | 功能描述:接口-I/O擴展器 I2C I/O EXPANDER GP RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9698DGG,512 | 功能描述:接口-I/O擴展器 I2C I/O EXPANDER GP RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
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