- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄367808 > PCA9502 (NXP Semiconductors N.V.) 8-bit I/O expander with I2C-bus/SPI interface PDF資料下載
參數(shù)資料
| 型號： | PCA9502 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 8-bit I/O expander with I2C-bus/SPI interface |
| 中文描述： | 8位I / O擴展接口與I2C-bus/SPI |
| 文件頁數(shù)： | 21/25頁 |
| 文件大?。?/td> | 125K |
| 代理商： | PCA9502 |
PCA9502_3
NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 03 — 13 October 2006
21 of 25
NXP Semiconductors
PCA9502
8-bit I/O expander with I
2
C-bus/SPI interface
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 20
) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 18
and
19
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 20
.
Table 18.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Table 19.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PCA9506 | 40-bit I2C-bus I/O port with RESET, OE, and INT |
| PCA9509 | Level translating I2C-bus/SMBus repeater |
| PCA9510A | Hot swappable I2C-bus and SMBus bus buffer |
| PCA9511A | Hot swappable I2C-bus and SMBus bus buffer |
| PCA9511DP | Hot swappable I2C and SMBus bus buffer |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCA9502BS | 功能描述:接口-I/O擴展器 8-BITI/O EXPDR W/I2C-SPI INTRF RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9502BS,128 | 功能描述:接口-I/O擴展器 8-BITI/O EXPDR RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9502BS,151 | 功能描述:接口-I/O擴展器 I/O EXPANDER I2C RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9502BS,157 | 功能描述:接口-I/O擴展器 8-BITI/O EXPDR RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9502BS-F | 功能描述:接口-I/O擴展器 8-BITI/O EXPDR W/I2C-SPI INTRF RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。