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參數(shù)資料
| 型號： | NAND04GA3C2AN1E |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | 4Gbit, 2112 Byte Page, 3V, Multi-level NAND Flash Memory |
| 中文描述： | 4Gbit的，2112字節(jié)的頁，3V供電，多級NAND閃存 |
| 文件頁數(shù)： | 11/51頁 |
| 文件大?。?/td> | 374K |
| 代理商： | NAND04GA3C2AN1E |
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NAND04GA3C2A, NAND04GW3C2A
2 Memory array organization
11/51
2
Memory array organization
The memory array is made up of NAND structures where 32 cells are connected in series.
The memory array is organized in blocks where each block contains 128 pages. The array is
split into two areas, the main area and the spare area. The main area of the array is used to
store data whereas the spare area is typically used to store software flags or Bad Block
identification.
The pages are split into a 2048 Byte main area and a spare area of 64 Bytes.Refer to
Figure 4: Memory Array Organization
.
2.1
Bad blocks
The NAND04GA3C2A and NAND04GW3C2A devices may contain Bad Blocks, that is
blocks that contain one or more invalid bits whose reliability is not guaranteed. Additional
Bad Blocks may develop during the lifetime of the device.
The Bad Block Information is written prior to shipping (refer to
Section 9.1: Bad block
management
for more details).
Table 4: Valid Blocks
shows the minimum number of valid blocks in each device. The values
shown include both the Bad Blocks that are present when the device is shipped and the Bad
Blocks that could develop later on.
These blocks need to be managed using Bad Blocks Management and Block Replacement
(refer to
Section 9: Software algorithms
).
Valid Blocks
Table 4.
Density of Device
Min
Max
4 Gbits
2008
2048
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| NAND04GA3C2AN6F | 4Gbit, 2112 Byte Page, 3V, Multi-level NAND Flash Memory |
| NAND04GW3C2AN6E | 4Gbit, 2112 Byte Page, 3V, Multi-level NAND Flash Memory |
| NAND128R3A2AZA1 | 128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories |
| NAND128W3A0AV6 | 128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories |
| NAND256R3A0AZB6 | 128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| NAND04GR3B2DDI6 | 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
| NAND04GR3B2DN6E | 功能描述:IC FLASH 4GBIT 48TSOP RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:576 系列:- 格式 - 存儲(chǔ)器:閃存 存儲(chǔ)器類型:閃存 - NAND 存儲(chǔ)容量:512M（64M x 8） 速度:- 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP（0.724"，18.40mm 寬） 供應(yīng)商設(shè)備封裝:48-TSOP 包裝:托盤 其它名稱:497-5040 |
| NAND04GR3B2DZL6F | 制造商:Micron Technology Inc 功能描述:NAND - Tape and Reel |
| NAND04GR3B2EN6E | 制造商:Micron Technology Inc 功能描述:NAND - Trays |
| NAND04GR3B2EN6F | 制造商:Micron Technology Inc 功能描述:NAND - Tape and Reel |
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