參數(shù)資料
型號: NAND01GR4B2BZA1F
廠商: STMICROELECTRONICS
元件分類: PROM
英文描述: 64M X 16 FLASH 1.8V PROM, 25000 ns, PBGA63
封裝: 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, VFBGA-63
文件頁數(shù): 1/63頁
文件大?。?/td> 684K
代理商: NAND01GR4B2BZA1F
PRELIMINARY DATA
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
June 2006
Rev 2
2
NAND01G-B2B
NAND02G-B2C
1 Gbit, 2 Gbit,
2112 Byte/1056 Word Page, 1.8V/3V, NAND Flash Memory
Feature summary
High Density NAND Flash memories
Up to 2 Gbit memory array
Up to 64Mbit spare area
Cost effective solutions for mass
storage applications
NAND interface
x8 or x16 bus width
Multiplexed Address/ Data
Pinout compatibility for all densities
Supply voltage
–1.8V device: VDD = 1.7 to 1.95V
–3.0V device: VDD = 2.7 to 3.6V
Page size
x8 device: (2048 + 64 spare) Bytes
x16 device: (1024 + 32 spare) Words
Block size
x8 device: (128K + 4K spare) Bytes
x16 device: (64K + 2K spare) Words
Page Read/Program
Random access: 25s (max)
Sequential access: 30ns (min)
Page program time: 200s (typ)
Copy Back Program mode
Fast page copy without external
buffering
Cache Program and Cache Read modes
Internal Cache Register to improve the
program and read throughputs
Fast Block Erase
Block erase time: 2ms (typ)
Status Register
Electronic Signature
Chip Enable ‘don’t care’
for simple interface with microcontroller
Serial Number option
Data protection
Hardware Block Locking
Hardware Program/Erase locked during
Power transitions
Data integrity
100,000 Program/Erase cycles
10 years Data Retention
ECOPACK packages
Development tools
Error Correction Code software and
hardware models
Bad Blocks Management and Wear
Leveling algorithms
File System OS Native reference
software
Hardware simulation models
FBGA
TSOP48 12 x 20mm
VFBGA63 9.5 x 12 x 1mm
VFBGA63 9 x 11 x 1mm
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