參數(shù)資料
型號(hào)： MT58L512Y36FT-8.5
廠商： CYPRESS SEMICONDUCTOR CORP
元件分類(lèi)： SRAM
英文描述： 512K X 36 CACHE SRAM, 8.5 ns, PQFP100
封裝： PLASTIC, TQFP-100
文件頁(yè)數(shù)： 27/34頁(yè)
文件大小： 537K
代理商： MT58L512Y36FT-8.5
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron, the M logo, the Micron logo, and SyncBurst are trademarks and/or service marks of Micron Technology, Inc.
Pentium is a registered trademark of Intel Corporation.
18Mb: 1 MEG x 18, 512K x 32/36
FLOW-THROUGH SYNCBURST SRAM
18Mb: 1 Meg x 18, 512K x 32/36, Flow-Through SyncBurst SRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT58L1MY18F_16_D.fm – Rev. D, Pub. 2/03
33
2003 Micron Technology, Inc.
Figure 21:
165-Ball FBGA
NOTE:
All dimensions in millimeters
or typical where noted.
Data Sheet Designation
No Marking: This data sheet contains minimum and maximum limits specified over the complete power
supply and temperature range for production devices. Although considered final, these specifications are sub-
ject to change, as further product development and data characterization sometimes occur.
10.00
14.00
15.00 ±0.10
1.00
TYP
1.00
TYP
5.00 ±0.05
13.00 ±0.10
PIN A1 ID
BALL A1
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
6.50 ±0.05
7.00 ±0.05
7.50 ±0.05
1.20 MAX
SOLDER BALL MATERIAL: EUTECTIC 62% Sn, 36% Pb, 2% Ag
SOLDER BALL PAD: .33mm
SOLDER BALL DIAMETER REFERS
TO POST REFLOW CONDITION. THE
PRE-REFLOW DIAMETER IS 0.40
SEATING PLANE
0.85 ±0.075
0.12 C
C
165X 0.45
BALL A11
MAX
MIN
--------------
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