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參數(shù)資料
| 型號： | MT47H128M8HQ-3AT |
| 元件分類： | DRAM |
| 英文描述： | 128M X 8 DDR DRAM, 0.4 ns, PBGA60 |
| 封裝： | 8 X 11.50 MM, ROHS COMPLIANT, FBGA-60 |
| 文件頁數(shù)： | 77/129頁 |
| 文件大小： | 9252K |
| 代理商： | MT47H128M8HQ-3AT |
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Table 27: AC Input Test Conditions
Parameter
Symbol
Min
Max
Units
Notes
Input setup timing measurement reference level address
balls, bank address balls, CS#, RAS#, CAS#, WE#, ODT,
DM, UDM, LDM, and CKE
VRS
See Note 2
Input hold timing measurement reference level address
balls, bank address balls, CS#, RAS#, CAS#, WE#, ODT,
DM, UDM, LDM, and CKE
VRH
See Note 5
Input timing measurement reference level (single-ended)
DQS for x4, x8; UDQS, LDQS for x16
VREF(DC)
VDDQ × 0.49 VDDQ × 0.51
V
Input timing measurement reference level (differential)
CK, CK# for x4, x8, x16; DQS, DQS# for x4, x8; RDQS,
RDQS# for x8; UDQS, UDQS#, LDQS, LDQS# for x16
VRD
VIX(AC)
V
Notes: 1. All voltages referenced to VSS.
2. Input waveform setup timing (tISb) is referenced from the input signal crossing at the
VIH(AC) level for a rising signal and VIL(AC) for a falling signal applied to the device under
test, as shown in Figure 31 (page 63).
4. The slew rate for single-ended inputs is measured from DC level to AC level, VIL(DC) to
VIH(AC) on the rising edge and VIL(AC) to VIH(DC) on the falling edge. For signals referenced
to VREF, the valid intersection is where the “tangent” line intersects VREF, as shown in
5. Input waveform hold (tIHb) timing is referenced from the input signal crossing at the
VIL(DC) level for a rising signal and VIH(DC) for a falling signal applied to the device under
test, as shown in Figure 31 (page 63).
6. Input waveform setup timing (tDS) and hold timing (tDH) for single-ended data strobe is
referenced from the crossing of DQS, UDQS, or LDQS through the Vref level applied to
the device under test, as shown in Figure 33 (page 64).
7. Input waveform setup timing (tDS) and hold timing (tDH) when differential data strobe
is enabled is referenced from the cross-point of DQS/DQS#, UDQS/UDQS#, or LDQS/
LDQS#, as shown in Figure 32 (page 63).
8. Input waveform timing is referenced to the crossing point level (VIX) of two input signals
(VTR and VCP) applied to the device under test, where VTR is the true input signal and VCP
is the complementary input signal, as shown in Figure 34 (page 64).
9. The slew rate for differentially ended inputs is measured from twice the DC level to
twice the AC level: 2 × VIL(DC) to 2 × VIH(AC) on the rising edge and 2 × VIL(AC) to 2 ×
VIH(DC) on the falling edge. For example, the CK/CK# would be –250mV to +500mV for
CK rising edge and would be +250mV to –500mV for CK falling edge.
1Gb: x4, x8, x16 1.55V DDR2 SDRAM
AC Overshoot/Undershoot Specification
PDF: 09005aef82b91d01
1GbDDR2_1_55V.PDF Rev. A 5/09 EN
51
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2009 Micron Technology, Inc. All rights reserved.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MT47H128M8HQ-3EAT | 制造商:MICRON 制造商全稱:Micron Technology 功能描述:DDR2 SDRAM |
| MT47H128M8HQ-3EIT | 制造商:MICRON 制造商全稱:Micron Technology 功能描述:DDR2 SDRAM |
| MT47H128M8HQ-3EL | 制造商:MICRON 制造商全稱:Micron Technology 功能描述:DDR2 SDRAM |
| MT47H128M8HQ-3IT | 制造商:MICRON 制造商全稱:Micron Technology 功能描述:DDR2 SDRAM |
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