參數(shù)資料
型號(hào)： MPC7400RX300LX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁(yè)數(shù)： 31/44頁(yè)
文件大?。?/td> 504K
代理商： MPC7400RX300LX
MPC7400 RISC Microprocessor Hardware Specications
37
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
System Design Information
There is no standardized way to number the COP header shown in Figure 22; consequently, many different
pin numbers have been observed from emulator vendors. Some are numbered top-to-bottom then left-to-
right, while others use left-to-right then top-to-bottom, while still others number the pins counter clockwise
from pin one (as with an IC). Regardless of the numbering, the signal placement recommended in Figure
22 is common to all known emulators.
The QACK signal shown in Table 17 is usually hooked up to the PCI bridge chip in a system and is an input
to the MPC7400 informing it that it can go into the quiescent state. Under normal operation this occurs
during a low power mode selection. In order for COP to work the MPC7400 must see this signal asserted
(pulled down). While shown on the COP header, not all emulator products drive this signal. To preserve
correct power down operation, QACK should be merged so that it also can be driven by the PCI bridge.
Table 17 shows the pin denitions.
1.8.9 Thermal Management Information
This section provides thermal management information for the ceramic ball grid array (CBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent upon the system-level
design—the heat sink, airow and thermal interface material. To reduce the die-junction temperature, heat
sinks may be attached to the package by several methods—adhesive, spring clip to holes in the printed-
circuit board or package, and mounting clip and screw assembly; see Figure 23. This spring force should
not exceed 5.5 pounds of force.
Table 17. COP Pin Definitions
Pins
Signal
Connection
Special Notes
1
TDO
2
QACK
Add 2K pulldown to ground. Must be merged with on-board QACK,
if any.
3
TDI
4
TRST
Add 2K pulldown to ground. Must be merged with on-board TRST, if
any. See Figure 21
5
RUN/STOP
No Connect
Used on 604e; leave no-connect for all other processors.
6
VDD_SENSE
VDD
Add 2K pullup to OVDD (for short circuit limiting protection only).
7
TCK
8
CKSTP_IN
Optional. Add 10K pullup to OVDD. Used on several emulator
products. Useful for checkstopping the processor from a logic
analyzer of other external trigger.
9
TMS
10
N/A
11
SRESET
Merge with on-board SRESET, if any.
12
N/A
13
HRESET
Merge with on-board HRESET.
14
N/A
Key location; pin should be removed.
15
CKSTP_OUT
Add 10K pullup to OVDD.
16
Ground
Digital Ground
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