參數(shù)資料
型號： MC7447RX1267LB
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 1267 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-360
文件頁數(shù)： 53/87頁
文件大小： 1586K
代理商： MC7447RX1267LB
MOTOROLA
MPC7457 RISC Microprocessor Hardware Specifications
57
System Design Information
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
1.9.8.1
Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table 3, the intrinsic conduction thermal resistance
paths are as follows:
The die junction-to-case (actually top-of-die since silicon die is exposed) thermal resistance
The die junction-to-ball thermal resistance
Figure 26 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 28. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Heat generated on the active side of the chip is conducted through the silicon, through the heat sink attach
material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.
Because the silicon thermal resistance is quite small, for a first-order analysis, the temperature drop in the
silicon may be neglected. Thus, the thermal interface material and the heat sink conduction/convective
thermal resistances are the dominant terms.
1.9.8.2
Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 27 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
As shown, the performance of these thermal interface materials improves with increasing contact pressure.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
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